JPS5231673A - Resin sealing method of semiconductor device - Google Patents
Resin sealing method of semiconductor deviceInfo
- Publication number
- JPS5231673A JPS5231673A JP10828175A JP10828175A JPS5231673A JP S5231673 A JPS5231673 A JP S5231673A JP 10828175 A JP10828175 A JP 10828175A JP 10828175 A JP10828175 A JP 10828175A JP S5231673 A JPS5231673 A JP S5231673A
- Authority
- JP
- Japan
- Prior art keywords
- resin sealing
- semiconductor device
- sealing method
- dimensions
- performance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE: To make the performance of good and continuous resin sealing work possible, by means of using the resin pellet with solid form with a specified quantity and dimensions.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10828175A JPS5231673A (en) | 1975-09-04 | 1975-09-04 | Resin sealing method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10828175A JPS5231673A (en) | 1975-09-04 | 1975-09-04 | Resin sealing method of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5231673A true JPS5231673A (en) | 1977-03-10 |
JPS5544453B2 JPS5544453B2 (en) | 1980-11-12 |
Family
ID=14480658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10828175A Granted JPS5231673A (en) | 1975-09-04 | 1975-09-04 | Resin sealing method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5231673A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53141578A (en) * | 1977-05-16 | 1978-12-09 | Fuji Electric Co Ltd | Glass-slurry applying device |
JPH0378234A (en) * | 1989-08-21 | 1991-04-03 | Rohm Co Ltd | Manufacture of semiconductor device |
US5042145A (en) * | 1988-09-27 | 1991-08-27 | Alcatel N.V. | Method for mounting an electronic component and memory card using same |
US5120678A (en) * | 1990-11-05 | 1992-06-09 | Motorola Inc. | Electrical component package comprising polymer-reinforced solder bump interconnection |
US5508888A (en) * | 1994-05-09 | 1996-04-16 | At&T Global Information Solutions Company | Electronic component lead protector |
-
1975
- 1975-09-04 JP JP10828175A patent/JPS5231673A/en active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53141578A (en) * | 1977-05-16 | 1978-12-09 | Fuji Electric Co Ltd | Glass-slurry applying device |
JPS626343B2 (en) * | 1977-05-16 | 1987-02-10 | Fuji Electric Co Ltd | |
US5042145A (en) * | 1988-09-27 | 1991-08-27 | Alcatel N.V. | Method for mounting an electronic component and memory card using same |
JPH0378234A (en) * | 1989-08-21 | 1991-04-03 | Rohm Co Ltd | Manufacture of semiconductor device |
US5120678A (en) * | 1990-11-05 | 1992-06-09 | Motorola Inc. | Electrical component package comprising polymer-reinforced solder bump interconnection |
US5508888A (en) * | 1994-05-09 | 1996-04-16 | At&T Global Information Solutions Company | Electronic component lead protector |
Also Published As
Publication number | Publication date |
---|---|
JPS5544453B2 (en) | 1980-11-12 |
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