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Hitachi Ltd
Original Assignee
Hitachi Ltd
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Publication date
Application filed by Hitachi LtdfiledCriticalHitachi Ltd
Priority to JP4128975ApriorityCriticalpatent/JPS51116680A/en
Publication of JPS51116680ApublicationCriticalpatent/JPS51116680A/en
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices
(AREA)
Abstract
PURPOSE: To avoid the occurrence of a void in a resin included semiconductor by protruding a resin layer at one end of the case, and by employing a molding method in which resin can be supplied for the one decreased by volume contraction.
COPYRIGHT: (C)1976,JPO&Japio
JP4128975A1975-04-071975-04-07Semiconductor device and its manumacturing method
PendingJPS51116680A
(en)