JPS5287982A - Resin molding method of semiconductor elements - Google Patents
Resin molding method of semiconductor elementsInfo
- Publication number
- JPS5287982A JPS5287982A JP522776A JP522776A JPS5287982A JP S5287982 A JPS5287982 A JP S5287982A JP 522776 A JP522776 A JP 522776A JP 522776 A JP522776 A JP 522776A JP S5287982 A JPS5287982 A JP S5287982A
- Authority
- JP
- Japan
- Prior art keywords
- molding method
- semiconductor elements
- resin molding
- frame
- opposedly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
PURPOSE: To prevent warpage of a frame by disposing the blanked side of the frame opposedly to a lower die and performing transfer molding.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP522776A JPS5287982A (en) | 1976-01-17 | 1976-01-17 | Resin molding method of semiconductor elements |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP522776A JPS5287982A (en) | 1976-01-17 | 1976-01-17 | Resin molding method of semiconductor elements |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5287982A true JPS5287982A (en) | 1977-07-22 |
JPS5524694B2 JPS5524694B2 (en) | 1980-07-01 |
Family
ID=11605288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP522776A Granted JPS5287982A (en) | 1976-01-17 | 1976-01-17 | Resin molding method of semiconductor elements |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5287982A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59150439A (en) * | 1984-01-20 | 1984-08-28 | Toshiba Corp | Semiconductor device |
US8863376B2 (en) | 2008-10-30 | 2014-10-21 | Fujitsu Limited | Connector removing jig and connector removing method using the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7421892B2 (en) | 2019-09-27 | 2024-01-25 | 株式会社マキタ | battery pack |
-
1976
- 1976-01-17 JP JP522776A patent/JPS5287982A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59150439A (en) * | 1984-01-20 | 1984-08-28 | Toshiba Corp | Semiconductor device |
JPS617736B2 (en) * | 1984-01-20 | 1986-03-08 | Tokyo Shibaura Electric Co | |
US8863376B2 (en) | 2008-10-30 | 2014-10-21 | Fujitsu Limited | Connector removing jig and connector removing method using the same |
Also Published As
Publication number | Publication date |
---|---|
JPS5524694B2 (en) | 1980-07-01 |
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