JPS5333576A - Ic molding method - Google Patents

Ic molding method

Info

Publication number
JPS5333576A
JPS5333576A JP10835176A JP10835176A JPS5333576A JP S5333576 A JPS5333576 A JP S5333576A JP 10835176 A JP10835176 A JP 10835176A JP 10835176 A JP10835176 A JP 10835176A JP S5333576 A JPS5333576 A JP S5333576A
Authority
JP
Japan
Prior art keywords
molding method
mold
holes
thin type
molding agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10835176A
Other languages
Japanese (ja)
Other versions
JPS5917533B2 (en
Inventor
Minoru Karasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Matsushima Kogyo KK
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Matsushima Kogyo KK
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushima Kogyo KK, Seiko Epson Corp, Suwa Seikosha KK filed Critical Matsushima Kogyo KK
Priority to JP10835176A priority Critical patent/JPS5917533B2/en
Publication of JPS5333576A publication Critical patent/JPS5333576A/en
Publication of JPS5917533B2 publication Critical patent/JPS5917533B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: To mold an IC in thin type by using a solid molding agent having through-holes.
COPYRIGHT: (C)1978,JPO&Japio
JP10835176A 1976-09-09 1976-09-09 IC chip molding method and solid molding agent Expired JPS5917533B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10835176A JPS5917533B2 (en) 1976-09-09 1976-09-09 IC chip molding method and solid molding agent

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10835176A JPS5917533B2 (en) 1976-09-09 1976-09-09 IC chip molding method and solid molding agent

Publications (2)

Publication Number Publication Date
JPS5333576A true JPS5333576A (en) 1978-03-29
JPS5917533B2 JPS5917533B2 (en) 1984-04-21

Family

ID=14482495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10835176A Expired JPS5917533B2 (en) 1976-09-09 1976-09-09 IC chip molding method and solid molding agent

Country Status (1)

Country Link
JP (1) JPS5917533B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0367429U (en) * 1989-11-02 1991-07-01

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0367429U (en) * 1989-11-02 1991-07-01

Also Published As

Publication number Publication date
JPS5917533B2 (en) 1984-04-21

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