JPS5347770A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5347770A
JPS5347770A JP12246176A JP12246176A JPS5347770A JP S5347770 A JPS5347770 A JP S5347770A JP 12246176 A JP12246176 A JP 12246176A JP 12246176 A JP12246176 A JP 12246176A JP S5347770 A JPS5347770 A JP S5347770A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
effluence
contamination
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12246176A
Other languages
Japanese (ja)
Other versions
JPS5638061B2 (en
Inventor
Harutoshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP12246176A priority Critical patent/JPS5347770A/en
Publication of JPS5347770A publication Critical patent/JPS5347770A/en
Publication of JPS5638061B2 publication Critical patent/JPS5638061B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To prevent the contamination of elements and the thermal deformation of substrate by bonding a resin effluence preventing frame through the use of an ultraviolet curing type bonding agent.
COPYRIGHT: (C)1978,JPO&Japio
JP12246176A 1976-10-13 1976-10-13 Production of semiconductor device Granted JPS5347770A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12246176A JPS5347770A (en) 1976-10-13 1976-10-13 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12246176A JPS5347770A (en) 1976-10-13 1976-10-13 Production of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5347770A true JPS5347770A (en) 1978-04-28
JPS5638061B2 JPS5638061B2 (en) 1981-09-03

Family

ID=14836420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12246176A Granted JPS5347770A (en) 1976-10-13 1976-10-13 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5347770A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5918438U (en) * 1982-07-27 1984-02-04 シチズン時計株式会社 IC sealing structure of electronic clock
JPS59125841U (en) * 1983-02-15 1984-08-24 松下電器産業株式会社 Stopping the flow of resin for protecting semiconductor elements

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4840663A (en) * 1971-09-29 1973-06-14
JPS5310859U (en) * 1976-07-09 1978-01-30

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4840663A (en) * 1971-09-29 1973-06-14
JPS5310859U (en) * 1976-07-09 1978-01-30

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5918438U (en) * 1982-07-27 1984-02-04 シチズン時計株式会社 IC sealing structure of electronic clock
JPS59125841U (en) * 1983-02-15 1984-08-24 松下電器産業株式会社 Stopping the flow of resin for protecting semiconductor elements

Also Published As

Publication number Publication date
JPS5638061B2 (en) 1981-09-03

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