JPS54578A - Resin seal semiconductor device - Google Patents

Resin seal semiconductor device

Info

Publication number
JPS54578A
JPS54578A JP6484077A JP6484077A JPS54578A JP S54578 A JPS54578 A JP S54578A JP 6484077 A JP6484077 A JP 6484077A JP 6484077 A JP6484077 A JP 6484077A JP S54578 A JPS54578 A JP S54578A
Authority
JP
Japan
Prior art keywords
semiconductor device
resin seal
seal semiconductor
connecting wires
disposing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6484077A
Other languages
Japanese (ja)
Inventor
Eiji Oi
Tadayasu Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6484077A priority Critical patent/JPS54578A/en
Publication of JPS54578A publication Critical patent/JPS54578A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Abstract

PURPOSE: To make even the thermal stress being applied to connecting wires by providing dummy pads and disposing the connecting wires to be nearly symmetrically to a semiconductor chip and a package respectively.
COPYRIGHT: (C)1979,JPO&Japio
JP6484077A 1977-06-03 1977-06-03 Resin seal semiconductor device Pending JPS54578A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6484077A JPS54578A (en) 1977-06-03 1977-06-03 Resin seal semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6484077A JPS54578A (en) 1977-06-03 1977-06-03 Resin seal semiconductor device

Publications (1)

Publication Number Publication Date
JPS54578A true JPS54578A (en) 1979-01-05

Family

ID=13269820

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6484077A Pending JPS54578A (en) 1977-06-03 1977-06-03 Resin seal semiconductor device

Country Status (1)

Country Link
JP (1) JPS54578A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01260845A (en) * 1988-02-22 1989-10-18 Motorola Inc Semiconductor device
JPH05144859A (en) * 1991-11-18 1993-06-11 Toowa Kk Molding method of electronic component with sealing resin

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01260845A (en) * 1988-02-22 1989-10-18 Motorola Inc Semiconductor device
JPH05144859A (en) * 1991-11-18 1993-06-11 Toowa Kk Molding method of electronic component with sealing resin

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