JPS52117067A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS52117067A
JPS52117067A JP3362576A JP3362576A JPS52117067A JP S52117067 A JPS52117067 A JP S52117067A JP 3362576 A JP3362576 A JP 3362576A JP 3362576 A JP3362576 A JP 3362576A JP S52117067 A JPS52117067 A JP S52117067A
Authority
JP
Japan
Prior art keywords
semiconductor
prepare
sealing
highly reliable
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3362576A
Other languages
Japanese (ja)
Inventor
Akira Suzuki
Sumio Nishida
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3362576A priority Critical patent/JPS52117067A/en
Publication of JPS52117067A publication Critical patent/JPS52117067A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prepare a highly reliable device by sealing up a chip covered with silicon resin by epoxy resin.
COPYRIGHT: (C)1977,JPO&Japio
JP3362576A 1976-03-29 1976-03-29 Semiconductor device Pending JPS52117067A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3362576A JPS52117067A (en) 1976-03-29 1976-03-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3362576A JPS52117067A (en) 1976-03-29 1976-03-29 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS52117067A true JPS52117067A (en) 1977-10-01

Family

ID=12391615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3362576A Pending JPS52117067A (en) 1976-03-29 1976-03-29 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS52117067A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03124052A (en) * 1989-10-06 1991-05-27 Nec Corp Resin-sealed semiconductor device
JPH04307760A (en) * 1991-04-04 1992-10-29 Mitsubishi Electric Corp Resin-sealed semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03124052A (en) * 1989-10-06 1991-05-27 Nec Corp Resin-sealed semiconductor device
JPH04307760A (en) * 1991-04-04 1992-10-29 Mitsubishi Electric Corp Resin-sealed semiconductor device

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