JPS5362473A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5362473A
JPS5362473A JP13730376A JP13730376A JPS5362473A JP S5362473 A JPS5362473 A JP S5362473A JP 13730376 A JP13730376 A JP 13730376A JP 13730376 A JP13730376 A JP 13730376A JP S5362473 A JPS5362473 A JP S5362473A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
effluence
undercoat
airtightness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13730376A
Other languages
Japanese (ja)
Inventor
Hatsuo Hayashi
Joga Imai
Masakatsu Toyoda
Hisao Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13730376A priority Critical patent/JPS5362473A/en
Publication of JPS5362473A publication Critical patent/JPS5362473A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To achieve the improvement in airtightness by providing an undercoat effluence preventing groove on the outside circumference of the pellet fixing part on a stem.
COPYRIGHT: (C)1978,JPO&Japio
JP13730376A 1976-11-17 1976-11-17 Production of semiconductor device Pending JPS5362473A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13730376A JPS5362473A (en) 1976-11-17 1976-11-17 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13730376A JPS5362473A (en) 1976-11-17 1976-11-17 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5362473A true JPS5362473A (en) 1978-06-03

Family

ID=15195523

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13730376A Pending JPS5362473A (en) 1976-11-17 1976-11-17 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5362473A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01183838A (en) * 1988-01-19 1989-07-21 Toshiba Corp Resin sealed type semiconductor device
JP2015227870A (en) * 2014-05-09 2015-12-17 株式会社フジクラ Semiconductor packaging structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01183838A (en) * 1988-01-19 1989-07-21 Toshiba Corp Resin sealed type semiconductor device
JP2015227870A (en) * 2014-05-09 2015-12-17 株式会社フジクラ Semiconductor packaging structure

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