JPS5219071A - Production method of semiconductor device - Google Patents

Production method of semiconductor device

Info

Publication number
JPS5219071A
JPS5219071A JP50095049A JP9504975A JPS5219071A JP S5219071 A JPS5219071 A JP S5219071A JP 50095049 A JP50095049 A JP 50095049A JP 9504975 A JP9504975 A JP 9504975A JP S5219071 A JPS5219071 A JP S5219071A
Authority
JP
Japan
Prior art keywords
semiconductor device
production method
connection
provide good
good result
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50095049A
Other languages
Japanese (ja)
Inventor
Kozo Odawara
Wataru Nozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50095049A priority Critical patent/JPS5219071A/en
Publication of JPS5219071A publication Critical patent/JPS5219071A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: A production method of semiconductor device which can always provide good result through simple inspection of the connection of lead lines.
COPYRIGHT: (C)1977,JPO&Japio
JP50095049A 1975-08-06 1975-08-06 Production method of semiconductor device Pending JPS5219071A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50095049A JPS5219071A (en) 1975-08-06 1975-08-06 Production method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50095049A JPS5219071A (en) 1975-08-06 1975-08-06 Production method of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5219071A true JPS5219071A (en) 1977-01-14

Family

ID=14127192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50095049A Pending JPS5219071A (en) 1975-08-06 1975-08-06 Production method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5219071A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5574148A (en) * 1978-11-29 1980-06-04 Nec Corp Production of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5574148A (en) * 1978-11-29 1980-06-04 Nec Corp Production of semiconductor device
JPS6142858B2 (en) * 1978-11-29 1986-09-24 Nippon Electric Co

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