JPS5574148A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5574148A
JPS5574148A JP14760278A JP14760278A JPS5574148A JP S5574148 A JPS5574148 A JP S5574148A JP 14760278 A JP14760278 A JP 14760278A JP 14760278 A JP14760278 A JP 14760278A JP S5574148 A JPS5574148 A JP S5574148A
Authority
JP
Japan
Prior art keywords
leads
open hole
electrodes
strip
pressure welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14760278A
Other languages
Japanese (ja)
Other versions
JPS6142858B2 (en
Inventor
Toshio Kasuga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP14760278A priority Critical patent/JPS5574148A/en
Publication of JPS5574148A publication Critical patent/JPS5574148A/en
Publication of JPS6142858B2 publication Critical patent/JPS6142858B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To accomplish accurate positioning of the electrodes and the leads by connecting the leads with a strip and chemically removing the strip after the treatment, in the pressure welding on the electrodes of a semiconductor element located at the open hole of the lead frame leads corresponding thereto.
CONSTITUTION: An open hole 15 is formed on a tape-shaped resin film 14 composing a lead frame 31 and a plurality of leads 13 are positioned thereat. Then, a semiconductor element is arranged in the open hole and the tips of the leads are fastened on the respective electrodes provided on the element by the thermal pressure welding or the ultrasonic welding to make a semiconductor device. Prior to the process, the leads 13 extended to the open hole 15 are connected by use of a fine connecting strip 16, which is removed by etching after the fastening. With such an arrangement, the pressure welding is made possible without any deviation in the position of the leads 13, thereby improving the reliability in the connection of the electrodes and the leads.
COPYRIGHT: (C)1980,JPO&Japio
JP14760278A 1978-11-29 1978-11-29 Production of semiconductor device Granted JPS5574148A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14760278A JPS5574148A (en) 1978-11-29 1978-11-29 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14760278A JPS5574148A (en) 1978-11-29 1978-11-29 Production of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5574148A true JPS5574148A (en) 1980-06-04
JPS6142858B2 JPS6142858B2 (en) 1986-09-24

Family

ID=15434038

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14760278A Granted JPS5574148A (en) 1978-11-29 1978-11-29 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5574148A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09326414A (en) * 1996-06-06 1997-12-16 Nec Corp Tape-carrier-package type semiconductor device
US6018189A (en) * 1997-03-31 2000-01-25 Nec Corporation Lead frame for face-down bonding

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63177582A (en) * 1987-01-19 1988-07-21 太陽誘電株式会社 Manufacture of hybrid integrated circuit device
CN101913046B (en) * 2010-05-21 2013-05-01 苏州固锝电子股份有限公司 Welding device for welding diode

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5219071A (en) * 1975-08-06 1977-01-14 Hitachi Ltd Production method of semiconductor device
JPS5341063U (en) * 1976-09-13 1978-04-10
JPS5346276A (en) * 1976-10-08 1978-04-25 Hitachi Ltd Carrier tape

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5341063B2 (en) * 1973-11-19 1978-10-31

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5219071A (en) * 1975-08-06 1977-01-14 Hitachi Ltd Production method of semiconductor device
JPS5341063U (en) * 1976-09-13 1978-04-10
JPS5346276A (en) * 1976-10-08 1978-04-25 Hitachi Ltd Carrier tape

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09326414A (en) * 1996-06-06 1997-12-16 Nec Corp Tape-carrier-package type semiconductor device
US6018189A (en) * 1997-03-31 2000-01-25 Nec Corporation Lead frame for face-down bonding

Also Published As

Publication number Publication date
JPS6142858B2 (en) 1986-09-24

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