JPS556852A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS556852A
JPS556852A JP7900578A JP7900578A JPS556852A JP S556852 A JPS556852 A JP S556852A JP 7900578 A JP7900578 A JP 7900578A JP 7900578 A JP7900578 A JP 7900578A JP S556852 A JPS556852 A JP S556852A
Authority
JP
Japan
Prior art keywords
finger
carrier tape
semiconductor chip
end portions
connecting end
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7900578A
Other languages
Japanese (ja)
Inventor
Miyoshi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7900578A priority Critical patent/JPS556852A/en
Publication of JPS556852A publication Critical patent/JPS556852A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Abstract

PURPOSE: To easily mount even a semiconductor chip with a number of electrodes by utilizing a film-carrier system, by severally forming each finger for connecting external wiring to the both surfaces of a carrier tape.
CONSTITUTION: Each projection electrode 9 of a semiconductor chip 8 is each positioned at the connecting end portions of each finger 5 formed on an upper surface of a carrier tape 7 and contacted and each projection electrode 10 at the connecting end portions of each finger 6 made up on a lower surface of the carrier tape 7 and contacted, and the electrodes and the connecting end portions are bonded by means of thermal pressure adhesion from the upper surfaces of each finger 5. Each projection electrode 9 and 10 of the semiconductor chip 8 is simultaneously connected to each finger 5 and 6 built up on the both surfaces of the carrier tape 7, and mounting is completed.
COPYRIGHT: (C)1980,JPO&Japio
JP7900578A 1978-06-28 1978-06-28 Semiconductor device Pending JPS556852A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7900578A JPS556852A (en) 1978-06-28 1978-06-28 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7900578A JPS556852A (en) 1978-06-28 1978-06-28 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS556852A true JPS556852A (en) 1980-01-18

Family

ID=13677827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7900578A Pending JPS556852A (en) 1978-06-28 1978-06-28 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS556852A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH031562A (en) * 1989-05-29 1991-01-08 Mitsui High Tec Inc Manufacture of lead frame
JPH03116035U (en) * 1990-03-12 1991-12-02
WO1992000603A1 (en) * 1990-06-26 1992-01-09 Seiko Epson Corporation Semiconductor device and method of manufacturing the same
JPH06120285A (en) * 1992-03-04 1994-04-28 Internatl Business Mach Corp <Ibm> Apparatus and method for reconstitution of input/output point of integrated circuit device and formation method of element for reconstitution of input/output point

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH031562A (en) * 1989-05-29 1991-01-08 Mitsui High Tec Inc Manufacture of lead frame
JPH03116035U (en) * 1990-03-12 1991-12-02
WO1992000603A1 (en) * 1990-06-26 1992-01-09 Seiko Epson Corporation Semiconductor device and method of manufacturing the same
US5313367A (en) * 1990-06-26 1994-05-17 Seiko Epson Corporation Semiconductor device having a multilayer interconnection structure
JPH06120285A (en) * 1992-03-04 1994-04-28 Internatl Business Mach Corp <Ibm> Apparatus and method for reconstitution of input/output point of integrated circuit device and formation method of element for reconstitution of input/output point

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