JPS5290268A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5290268A
JPS5290268A JP592476A JP592476A JPS5290268A JP S5290268 A JPS5290268 A JP S5290268A JP 592476 A JP592476 A JP 592476A JP 592476 A JP592476 A JP 592476A JP S5290268 A JPS5290268 A JP S5290268A
Authority
JP
Japan
Prior art keywords
semiconductor device
packings
junctions
enclosing
mechanically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP592476A
Other languages
Japanese (ja)
Inventor
Ryosaku Kanzawa
Hideyuki Yagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP592476A priority Critical patent/JPS5290268A/en
Publication of JPS5290268A publication Critical patent/JPS5290268A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/10175—Flow barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors

Abstract

PURPOSE: To improve surface stability by providing solder packings in plural positions of the counter space between a semiconductor chip and a substrate, connecting and fixing these electrically and mechanically and enclosing and sealing the surface of PN junctions.
COPYRIGHT: (C)1977,JPO&Japio
JP592476A 1976-01-23 1976-01-23 Semiconductor device Pending JPS5290268A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP592476A JPS5290268A (en) 1976-01-23 1976-01-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP592476A JPS5290268A (en) 1976-01-23 1976-01-23 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5290268A true JPS5290268A (en) 1977-07-29

Family

ID=11624432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP592476A Pending JPS5290268A (en) 1976-01-23 1976-01-23 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5290268A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS578477A (en) * 1980-06-20 1982-01-16 Japanese National Railways<Jnr> Method and apparatus for measuring changeover time of trolley wire
JPS5891646A (en) * 1981-11-26 1983-05-31 Toshiba Corp Semiconductor device
JPS5988864A (en) * 1982-11-12 1984-05-22 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
JP2007103839A (en) * 2005-10-07 2007-04-19 Nec Electronics Corp Semiconductor device
JP2008166753A (en) * 2006-12-29 2008-07-17 Optopac Co Ltd Semiconductor device package and method for manufacturing and mounting same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS578477A (en) * 1980-06-20 1982-01-16 Japanese National Railways<Jnr> Method and apparatus for measuring changeover time of trolley wire
JPS5891646A (en) * 1981-11-26 1983-05-31 Toshiba Corp Semiconductor device
JPS5988864A (en) * 1982-11-12 1984-05-22 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
JP2007103839A (en) * 2005-10-07 2007-04-19 Nec Electronics Corp Semiconductor device
JP2008166753A (en) * 2006-12-29 2008-07-17 Optopac Co Ltd Semiconductor device package and method for manufacturing and mounting same

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