JPS5326666A - Semiconduct or device - Google Patents
Semiconduct or deviceInfo
- Publication number
- JPS5326666A JPS5326666A JP10061376A JP10061376A JPS5326666A JP S5326666 A JPS5326666 A JP S5326666A JP 10061376 A JP10061376 A JP 10061376A JP 10061376 A JP10061376 A JP 10061376A JP S5326666 A JPS5326666 A JP S5326666A
- Authority
- JP
- Japan
- Prior art keywords
- connection
- pad
- semiconduct
- ccb
- simplify
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE: To simplify the electrode connection with CCB technique, etc. by providing only the connection pad on the rear surface of a semiconductor chip and securing a connection via wiring pierced holes between the pad and the circuit element on the chip surface.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10061376A JPS5326666A (en) | 1976-08-25 | 1976-08-25 | Semiconduct or device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10061376A JPS5326666A (en) | 1976-08-25 | 1976-08-25 | Semiconduct or device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5326666A true JPS5326666A (en) | 1978-03-11 |
Family
ID=14278683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10061376A Pending JPS5326666A (en) | 1976-08-25 | 1976-08-25 | Semiconduct or device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5326666A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100425391B1 (en) * | 2000-01-21 | 2004-03-30 | 세이코 엡슨 가부시키가이샤 | Semiconductor device and method of making the same, circuit board and electronic instrument |
-
1976
- 1976-08-25 JP JP10061376A patent/JPS5326666A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100425391B1 (en) * | 2000-01-21 | 2004-03-30 | 세이코 엡슨 가부시키가이샤 | Semiconductor device and method of making the same, circuit board and electronic instrument |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5326689A (en) | Semiconductor integrated circuit unit | |
JPS5230162A (en) | Semiconductor device | |
JPS5230184A (en) | Semiconductor device | |
JPS5326666A (en) | Semiconduct or device | |
JPS52124829A (en) | Common buss control circuit | |
JPS534472A (en) | Semiconductor package | |
JPS538566A (en) | Mounting structure of semiconductor ic circuit | |
JPS5353261A (en) | Electronic device | |
JPS5319760A (en) | Integrated circuit device | |
JPS5265666A (en) | Semiconductor device | |
JPS52116073A (en) | Hermetic structure in which integrated circuit element is sealed up ai rtightly | |
JPS5212572A (en) | Semi-conductor device | |
JPS5353260A (en) | Electronic device | |
JPS5356969A (en) | Production of tape for tape carrier | |
JPS5379462A (en) | Manufacture of semiconductor integrated circuit | |
JPS52119875A (en) | Formation of isolation area | |
JPS5355971A (en) | Engagement method and electronic device using said method | |
JPS5368163A (en) | Production of flip chip | |
JPS52113160A (en) | Preparation of semiconductor device | |
JPS52108774A (en) | Fitting material for integrated circuit | |
JPS53119676A (en) | Semiconductor device | |
JPS5353968A (en) | Electronic circuit device | |
JPS5355973A (en) | Electronic device | |
JPS5355972A (en) | Engagement method and electronic device using said method | |
JPS52150965A (en) | Semiconductor device |