JPS538566A - Mounting structure of semiconductor ic circuit - Google Patents

Mounting structure of semiconductor ic circuit

Info

Publication number
JPS538566A
JPS538566A JP8202876A JP8202876A JPS538566A JP S538566 A JPS538566 A JP S538566A JP 8202876 A JP8202876 A JP 8202876A JP 8202876 A JP8202876 A JP 8202876A JP S538566 A JPS538566 A JP S538566A
Authority
JP
Japan
Prior art keywords
circuit
semiconductor
mounting structure
chip
position deciding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8202876A
Other languages
Japanese (ja)
Inventor
Hiroyuki Miyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP8202876A priority Critical patent/JPS538566A/en
Publication of JPS538566A publication Critical patent/JPS538566A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To provide a convex part touching IC chip on the circuit substrate or providing a position deciding material in the flat direction of the chip, and thus to facilitate the position deciding as well as securing a constant gap between the substrate and the chip.
COPYRIGHT: (C)1978,JPO&Japio
JP8202876A 1976-07-12 1976-07-12 Mounting structure of semiconductor ic circuit Pending JPS538566A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8202876A JPS538566A (en) 1976-07-12 1976-07-12 Mounting structure of semiconductor ic circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8202876A JPS538566A (en) 1976-07-12 1976-07-12 Mounting structure of semiconductor ic circuit

Publications (1)

Publication Number Publication Date
JPS538566A true JPS538566A (en) 1978-01-26

Family

ID=13763061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8202876A Pending JPS538566A (en) 1976-07-12 1976-07-12 Mounting structure of semiconductor ic circuit

Country Status (1)

Country Link
JP (1) JPS538566A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56155591A (en) * 1980-05-06 1981-12-01 Oki Electric Ind Co Ltd Method of mounting chip carrier
JPS6073250U (en) * 1983-10-25 1985-05-23 セイコーインスツルメンツ株式会社 circuit board structure
JPH01235341A (en) * 1988-03-16 1989-09-20 Fujitsu Ltd Mounting of semiconductor component
JPH0311693A (en) * 1989-06-08 1991-01-18 Sansha Electric Mfg Co Ltd Circuit substrate for semiconductor device
JP2006133259A (en) * 2004-11-02 2006-05-25 Seiko Epson Corp Mounting structure, electro-optical device, manufacturing method of the electro-optical device, and electronic equipment
JP2019192667A (en) * 2018-04-18 2019-10-31 新光電気工業株式会社 Semiconductor device and method of manufacturing the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56155591A (en) * 1980-05-06 1981-12-01 Oki Electric Ind Co Ltd Method of mounting chip carrier
JPS6073250U (en) * 1983-10-25 1985-05-23 セイコーインスツルメンツ株式会社 circuit board structure
JPH01235341A (en) * 1988-03-16 1989-09-20 Fujitsu Ltd Mounting of semiconductor component
JPH0311693A (en) * 1989-06-08 1991-01-18 Sansha Electric Mfg Co Ltd Circuit substrate for semiconductor device
JP2006133259A (en) * 2004-11-02 2006-05-25 Seiko Epson Corp Mounting structure, electro-optical device, manufacturing method of the electro-optical device, and electronic equipment
JP2019192667A (en) * 2018-04-18 2019-10-31 新光電気工業株式会社 Semiconductor device and method of manufacturing the same

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