JPS5326689A - Semiconductor integrated circuit unit - Google Patents
Semiconductor integrated circuit unitInfo
- Publication number
- JPS5326689A JPS5326689A JP10059676A JP10059676A JPS5326689A JP S5326689 A JPS5326689 A JP S5326689A JP 10059676 A JP10059676 A JP 10059676A JP 10059676 A JP10059676 A JP 10059676A JP S5326689 A JPS5326689 A JP S5326689A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit unit
- semiconductor integrated
- elements
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE: To increase the integration density by forming circuit elements on both surfaces of a chip and connecting these elements mutually via pierced holes.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10059676A JPS5326689A (en) | 1976-08-25 | 1976-08-25 | Semiconductor integrated circuit unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10059676A JPS5326689A (en) | 1976-08-25 | 1976-08-25 | Semiconductor integrated circuit unit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5326689A true JPS5326689A (en) | 1978-03-11 |
Family
ID=14278238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10059676A Pending JPS5326689A (en) | 1976-08-25 | 1976-08-25 | Semiconductor integrated circuit unit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5326689A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4585490A (en) * | 1981-12-07 | 1986-04-29 | Massachusetts Institute Of Technology | Method of making a conductive path in multi-layer metal structures by low power laser beam |
KR100425391B1 (en) * | 2000-01-21 | 2004-03-30 | 세이코 엡슨 가부시키가이샤 | Semiconductor device and method of making the same, circuit board and electronic instrument |
US7276738B2 (en) | 2000-07-11 | 2007-10-02 | Seiko Epson Corporation | Miniature optical element for wireless bonding in an electronic instrument |
JPWO2021070366A1 (en) * | 2019-10-11 | 2021-04-15 | ||
WO2021070367A1 (en) * | 2019-10-11 | 2021-04-15 | 株式会社ソシオネクスト | Semiconductor device |
WO2021079511A1 (en) * | 2019-10-25 | 2021-04-29 | 株式会社ソシオネクスト | Semiconductor device |
WO2021111604A1 (en) * | 2019-12-05 | 2021-06-10 | 株式会社ソシオネクスト | Semiconductor device |
-
1976
- 1976-08-25 JP JP10059676A patent/JPS5326689A/en active Pending
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4585490A (en) * | 1981-12-07 | 1986-04-29 | Massachusetts Institute Of Technology | Method of making a conductive path in multi-layer metal structures by low power laser beam |
KR100425391B1 (en) * | 2000-01-21 | 2004-03-30 | 세이코 엡슨 가부시키가이샤 | Semiconductor device and method of making the same, circuit board and electronic instrument |
US7276738B2 (en) | 2000-07-11 | 2007-10-02 | Seiko Epson Corporation | Miniature optical element for wireless bonding in an electronic instrument |
US7544973B2 (en) | 2000-07-11 | 2009-06-09 | Seiko Epson Corporation | Miniature optical element for wireless bonding in an electronic instrument |
US7879633B2 (en) | 2000-07-11 | 2011-02-01 | Seiko Epson Corporation | Miniature optical element for wireless bonding in an electronic instrument |
WO2021070367A1 (en) * | 2019-10-11 | 2021-04-15 | 株式会社ソシオネクスト | Semiconductor device |
JPWO2021070366A1 (en) * | 2019-10-11 | 2021-04-15 | ||
WO2021070366A1 (en) * | 2019-10-11 | 2021-04-15 | 株式会社ソシオネクスト | Semiconductor device |
JPWO2021070367A1 (en) * | 2019-10-11 | 2021-04-15 | ||
US12119301B2 (en) | 2019-10-11 | 2024-10-15 | Socionext Inc. | Semiconductor device |
WO2021079511A1 (en) * | 2019-10-25 | 2021-04-29 | 株式会社ソシオネクスト | Semiconductor device |
JPWO2021079511A1 (en) * | 2019-10-25 | 2021-04-29 | ||
WO2021111604A1 (en) * | 2019-12-05 | 2021-06-10 | 株式会社ソシオネクスト | Semiconductor device |
JPWO2021111604A1 (en) * | 2019-12-05 | 2021-06-10 |
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