JPS5326689A - Semiconductor integrated circuit unit - Google Patents

Semiconductor integrated circuit unit

Info

Publication number
JPS5326689A
JPS5326689A JP10059676A JP10059676A JPS5326689A JP S5326689 A JPS5326689 A JP S5326689A JP 10059676 A JP10059676 A JP 10059676A JP 10059676 A JP10059676 A JP 10059676A JP S5326689 A JPS5326689 A JP S5326689A
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit unit
semiconductor integrated
elements
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10059676A
Other languages
Japanese (ja)
Inventor
Masaaki Hoashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10059676A priority Critical patent/JPS5326689A/en
Publication of JPS5326689A publication Critical patent/JPS5326689A/en
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: To increase the integration density by forming circuit elements on both surfaces of a chip and connecting these elements mutually via pierced holes.
COPYRIGHT: (C)1978,JPO&Japio
JP10059676A 1976-08-25 1976-08-25 Semiconductor integrated circuit unit Pending JPS5326689A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10059676A JPS5326689A (en) 1976-08-25 1976-08-25 Semiconductor integrated circuit unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10059676A JPS5326689A (en) 1976-08-25 1976-08-25 Semiconductor integrated circuit unit

Publications (1)

Publication Number Publication Date
JPS5326689A true JPS5326689A (en) 1978-03-11

Family

ID=14278238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10059676A Pending JPS5326689A (en) 1976-08-25 1976-08-25 Semiconductor integrated circuit unit

Country Status (1)

Country Link
JP (1) JPS5326689A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4585490A (en) * 1981-12-07 1986-04-29 Massachusetts Institute Of Technology Method of making a conductive path in multi-layer metal structures by low power laser beam
KR100425391B1 (en) * 2000-01-21 2004-03-30 세이코 엡슨 가부시키가이샤 Semiconductor device and method of making the same, circuit board and electronic instrument
US7276738B2 (en) 2000-07-11 2007-10-02 Seiko Epson Corporation Miniature optical element for wireless bonding in an electronic instrument
JPWO2021070366A1 (en) * 2019-10-11 2021-04-15
WO2021070367A1 (en) * 2019-10-11 2021-04-15 株式会社ソシオネクスト Semiconductor device
WO2021079511A1 (en) * 2019-10-25 2021-04-29 株式会社ソシオネクスト Semiconductor device
WO2021111604A1 (en) * 2019-12-05 2021-06-10 株式会社ソシオネクスト Semiconductor device

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4585490A (en) * 1981-12-07 1986-04-29 Massachusetts Institute Of Technology Method of making a conductive path in multi-layer metal structures by low power laser beam
KR100425391B1 (en) * 2000-01-21 2004-03-30 세이코 엡슨 가부시키가이샤 Semiconductor device and method of making the same, circuit board and electronic instrument
US7276738B2 (en) 2000-07-11 2007-10-02 Seiko Epson Corporation Miniature optical element for wireless bonding in an electronic instrument
US7544973B2 (en) 2000-07-11 2009-06-09 Seiko Epson Corporation Miniature optical element for wireless bonding in an electronic instrument
US7879633B2 (en) 2000-07-11 2011-02-01 Seiko Epson Corporation Miniature optical element for wireless bonding in an electronic instrument
WO2021070367A1 (en) * 2019-10-11 2021-04-15 株式会社ソシオネクスト Semiconductor device
JPWO2021070366A1 (en) * 2019-10-11 2021-04-15
WO2021070366A1 (en) * 2019-10-11 2021-04-15 株式会社ソシオネクスト Semiconductor device
JPWO2021070367A1 (en) * 2019-10-11 2021-04-15
US12119301B2 (en) 2019-10-11 2024-10-15 Socionext Inc. Semiconductor device
WO2021079511A1 (en) * 2019-10-25 2021-04-29 株式会社ソシオネクスト Semiconductor device
JPWO2021079511A1 (en) * 2019-10-25 2021-04-29
WO2021111604A1 (en) * 2019-12-05 2021-06-10 株式会社ソシオネクスト Semiconductor device
JPWO2021111604A1 (en) * 2019-12-05 2021-06-10

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