JPS5353260A - Electronic device - Google Patents

Electronic device

Info

Publication number
JPS5353260A
JPS5353260A JP12854576A JP12854576A JPS5353260A JP S5353260 A JPS5353260 A JP S5353260A JP 12854576 A JP12854576 A JP 12854576A JP 12854576 A JP12854576 A JP 12854576A JP S5353260 A JPS5353260 A JP S5353260A
Authority
JP
Japan
Prior art keywords
electronic device
thin film
chip
conduction
secure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12854576A
Other languages
Japanese (ja)
Inventor
Kanemitsu Kubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Epson Corp
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK, Epson Corp filed Critical Seiko Epson Corp
Priority to JP12854576A priority Critical patent/JPS5353260A/en
Publication of JPS5353260A publication Critical patent/JPS5353260A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To secure a conduction between an IC chip and an IC pad by only pressing the IC chip onto the lead frame, thin film or thin film circuit via a conductive anisotropic and elastic substance.
COPYRIGHT: (C)1978,JPO&Japio
JP12854576A 1976-10-26 1976-10-26 Electronic device Pending JPS5353260A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12854576A JPS5353260A (en) 1976-10-26 1976-10-26 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12854576A JPS5353260A (en) 1976-10-26 1976-10-26 Electronic device

Publications (1)

Publication Number Publication Date
JPS5353260A true JPS5353260A (en) 1978-05-15

Family

ID=14987394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12854576A Pending JPS5353260A (en) 1976-10-26 1976-10-26 Electronic device

Country Status (1)

Country Link
JP (1) JPS5353260A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6271899U (en) * 1985-10-25 1987-05-08
JPS6298594A (en) * 1985-10-25 1987-05-08 アルプス電気株式会社 Terminal connection of electroluminescence device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6271899U (en) * 1985-10-25 1987-05-08
JPS6298594A (en) * 1985-10-25 1987-05-08 アルプス電気株式会社 Terminal connection of electroluminescence device

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