JPS5355970A - Electronic device - Google Patents

Electronic device

Info

Publication number
JPS5355970A
JPS5355970A JP13104276A JP13104276A JPS5355970A JP S5355970 A JPS5355970 A JP S5355970A JP 13104276 A JP13104276 A JP 13104276A JP 13104276 A JP13104276 A JP 13104276A JP S5355970 A JPS5355970 A JP S5355970A
Authority
JP
Japan
Prior art keywords
electronic device
lead frame
thin film
thick film
film circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13104276A
Other languages
Japanese (ja)
Inventor
Kanemitsu Kubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Epson Corp
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK, Epson Corp filed Critical Seiko Epson Corp
Priority to JP13104276A priority Critical patent/JPS5355970A/en
Publication of JPS5355970A publication Critical patent/JPS5355970A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To secure an electric conduction between each pad of an IC and the lead frame, thick film or thin film circuit by just pressing the IC chip to the lead frame or onto the thin film or thick film circuit via a conductive ansiotropic elastic substance.
COPYRIGHT: (C)1978,JPO&Japio
JP13104276A 1976-10-29 1976-10-29 Electronic device Pending JPS5355970A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13104276A JPS5355970A (en) 1976-10-29 1976-10-29 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13104276A JPS5355970A (en) 1976-10-29 1976-10-29 Electronic device

Publications (1)

Publication Number Publication Date
JPS5355970A true JPS5355970A (en) 1978-05-20

Family

ID=15048652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13104276A Pending JPS5355970A (en) 1976-10-29 1976-10-29 Electronic device

Country Status (1)

Country Link
JP (1) JPS5355970A (en)

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