JPS53141574A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS53141574A
JPS53141574A JP5672077A JP5672077A JPS53141574A JP S53141574 A JPS53141574 A JP S53141574A JP 5672077 A JP5672077 A JP 5672077A JP 5672077 A JP5672077 A JP 5672077A JP S53141574 A JPS53141574 A JP S53141574A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
etching
insulation film
pad surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5672077A
Other languages
Japanese (ja)
Inventor
Masahiko Nakamae
Sazuku Kamata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP5672077A priority Critical patent/JPS53141574A/en
Publication of JPS53141574A publication Critical patent/JPS53141574A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8501—Cleaning, e.g. oxide removal step, desmearing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8501—Cleaning, e.g. oxide removal step, desmearing
    • H01L2224/85013—Plasma cleaning

Abstract

PURPOSE: To connect fine wires accurately by previously plasma-etching and removing an insulation film on a junction pad surface.
COPYRIGHT: (C)1978,JPO&Japio
JP5672077A 1977-05-16 1977-05-16 Manufacture of semiconductor device Pending JPS53141574A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5672077A JPS53141574A (en) 1977-05-16 1977-05-16 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5672077A JPS53141574A (en) 1977-05-16 1977-05-16 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS53141574A true JPS53141574A (en) 1978-12-09

Family

ID=13035316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5672077A Pending JPS53141574A (en) 1977-05-16 1977-05-16 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS53141574A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61101040A (en) * 1984-10-24 1986-05-19 Hitachi Ltd Bonding device
JPS61105850A (en) * 1984-10-30 1986-05-23 Mitsubishi Electric Corp Wire bonding method
JPS6226834A (en) * 1985-07-26 1987-02-04 Mitsubishi Electric Corp Manufacture of semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4994573A (en) * 1972-11-01 1974-09-07
JPS511668B2 (en) * 1972-11-29 1976-01-19

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4994573A (en) * 1972-11-01 1974-09-07
JPS511668B2 (en) * 1972-11-29 1976-01-19

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61101040A (en) * 1984-10-24 1986-05-19 Hitachi Ltd Bonding device
JPH0586857B2 (en) * 1984-10-24 1993-12-14 Hitachi Ltd
JPS61105850A (en) * 1984-10-30 1986-05-23 Mitsubishi Electric Corp Wire bonding method
JPS6226834A (en) * 1985-07-26 1987-02-04 Mitsubishi Electric Corp Manufacture of semiconductor device
JPH04595B2 (en) * 1985-07-26 1992-01-08 Mitsubishi Electric Corp

Similar Documents

Publication Publication Date Title
JPS5293285A (en) Structure for semiconductor device
JPS53141574A (en) Manufacture of semiconductor device
JPS5230162A (en) Semiconductor device
JPS5378173A (en) Manufacture of semiconductor device
JPS5341181A (en) Semiconductor device
JPS51121267A (en) Semiconductor wafer measuring device
JPS5265666A (en) Semiconductor device
JPS52129380A (en) Semiconductor device
JPS5380183A (en) Semiconductor device
JPS5420670A (en) Surface stabilizing method of semiconductor elements
JPS5212572A (en) Semi-conductor device
JPS5268388A (en) Semiconductor integrated circuit
JPS52144276A (en) Semiconductor device
JPS5392679A (en) Semiconductor device
JPS5379462A (en) Manufacture of semiconductor integrated circuit
JPS52141566A (en) Semiconductor device and its manufacture
JPS528787A (en) Semiconductor device process
JPS53141575A (en) Semiconductor device
JPS5349948A (en) Semiconductor device
JPS51118965A (en) Insulation film of semiconductor device
JPS53124065A (en) Manufacture of semiconductor device
JPS5260581A (en) Semiconductor device
JPS52108775A (en) Semiconductor device
JPS51151089A (en) Manufacturing method of a semiconductor
JPS5434784A (en) Semiconductor integrated circuit device