JPS52113160A - Preparation of semiconductor device - Google Patents

Preparation of semiconductor device

Info

Publication number
JPS52113160A
JPS52113160A JP3011176A JP3011176A JPS52113160A JP S52113160 A JPS52113160 A JP S52113160A JP 3011176 A JP3011176 A JP 3011176A JP 3011176 A JP3011176 A JP 3011176A JP S52113160 A JPS52113160 A JP S52113160A
Authority
JP
Japan
Prior art keywords
hole
preparation
semiconductor device
providing
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3011176A
Other languages
Japanese (ja)
Inventor
Hiroaki Fujimoto
Masaharu Noyori
Isamu Kitahiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP3011176A priority Critical patent/JPS52113160A/en
Publication of JPS52113160A publication Critical patent/JPS52113160A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9212—Sequential connecting processes
    • H01L2224/92142—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92144—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect

Abstract

PURPOSE: To form conductor wiring having a narrow interval by providing one principal surface of a heat-resistant substrate with recesses into which the element is insertable, providing the bottom surface with a hole in coincidence with the element's electrode and bonding correctly the hole to a hole in a bonding layer on the surface of the element.
COPYRIGHT: (C)1977,JPO&Japio
JP3011176A 1976-03-18 1976-03-18 Preparation of semiconductor device Pending JPS52113160A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3011176A JPS52113160A (en) 1976-03-18 1976-03-18 Preparation of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3011176A JPS52113160A (en) 1976-03-18 1976-03-18 Preparation of semiconductor device

Publications (1)

Publication Number Publication Date
JPS52113160A true JPS52113160A (en) 1977-09-22

Family

ID=12294656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3011176A Pending JPS52113160A (en) 1976-03-18 1976-03-18 Preparation of semiconductor device

Country Status (1)

Country Link
JP (1) JPS52113160A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2039268A1 (en) * 1970-08-07 1972-02-10 Weinmann & Co Kg Side-pull rim brake

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2039268A1 (en) * 1970-08-07 1972-02-10 Weinmann & Co Kg Side-pull rim brake

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