JPS54119877A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54119877A
JPS54119877A JP2596578A JP2596578A JPS54119877A JP S54119877 A JPS54119877 A JP S54119877A JP 2596578 A JP2596578 A JP 2596578A JP 2596578 A JP2596578 A JP 2596578A JP S54119877 A JPS54119877 A JP S54119877A
Authority
JP
Japan
Prior art keywords
leads
tape
deformation
bridged
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2596578A
Other languages
Japanese (ja)
Inventor
Shinichi Shibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP2596578A priority Critical patent/JPS54119877A/en
Priority to EP19790100700 priority patent/EP0004570B1/en
Publication of JPS54119877A publication Critical patent/JPS54119877A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To increase the yield rate and to make assembling quick, by preventing the deformation of leads through the avoidance of the free ends of leads for tape.
CONSTITUTION: Copper foil is attached to the polyimide resin film 11, the copper foil is etched in the form that the window holes 13,13',13"... placed at the part corresponding to the junction of the semiconductor element 12 are bridged 14a,14a', 14a", forming the leads 14,14',14". The electrode pads 12a,12a',12a"... of the element 12 are assembled by bonding the bridged parts. Thus, no lead play end is present at the tape, and the leads cause no deformation because the bonded parts of leads are fixed on the film for the ends, and assembling can rapidly be made.
COPYRIGHT: (C)1979,JPO&Japio
JP2596578A 1978-03-09 1978-03-09 Semiconductor device Pending JPS54119877A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2596578A JPS54119877A (en) 1978-03-09 1978-03-09 Semiconductor device
EP19790100700 EP0004570B1 (en) 1978-03-09 1979-03-08 Thiol esters, process for their preparation, pharmaceutical compositions containing them and a process for preparing cephalosporin compounds using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2596578A JPS54119877A (en) 1978-03-09 1978-03-09 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS54119877A true JPS54119877A (en) 1979-09-18

Family

ID=12180437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2596578A Pending JPS54119877A (en) 1978-03-09 1978-03-09 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54119877A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS635636U (en) * 1986-06-26 1988-01-14
JPH0355857A (en) * 1989-07-25 1991-03-11 Fujitsu Ltd Semiconductor device and its manufacture
JPH0479341A (en) * 1990-07-23 1992-03-12 Nippon Telegr & Teleph Corp <Ntt> Flexible wiring board
JPH07226418A (en) * 1993-12-16 1995-08-22 Nec Corp Chip carrier semiconductor device and its manufacture

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS635636U (en) * 1986-06-26 1988-01-14
JPH0355857A (en) * 1989-07-25 1991-03-11 Fujitsu Ltd Semiconductor device and its manufacture
JPH0479341A (en) * 1990-07-23 1992-03-12 Nippon Telegr & Teleph Corp <Ntt> Flexible wiring board
JPH07226418A (en) * 1993-12-16 1995-08-22 Nec Corp Chip carrier semiconductor device and its manufacture

Similar Documents

Publication Publication Date Title
JPS577985A (en) Magnetoelectricity converting element and manufacture thereof
JPS5435679A (en) Semiconductor connection method
JPS54119877A (en) Semiconductor device
JPS5423484A (en) Semiconductor integrated circuit and its manufacture
JPS5389368A (en) Production of semiconductor integrated circuit
JPS5455169A (en) Semiconductor device
JPS522282A (en) Semiconductor device
JPS556852A (en) Semiconductor device
JPS5315762A (en) Production of semiconductor device
JPS51127678A (en) Semiconductor device and its manufacturing method
JPS5315759A (en) Electronic parts
JPS5571051A (en) Semiconductor device
JPS5377172A (en) Production of semiconductor device
JPS52126183A (en) Preparation of semiconductor device
JPS54139589A (en) Temperature detector
JPS54578A (en) Resin seal semiconductor device
JPS522281A (en) Method of making semiconductor devices
JPS5370766A (en) Semiconductor device
JPS5360170A (en) Input/output pads of ic chip
JPS5379462A (en) Manufacture of semiconductor integrated circuit
JPS5344173A (en) Semiconductor integrated circuit device
JPS5344171A (en) Semiconductor device
JPS5396670A (en) Pellet bonding method
JPS547272A (en) Semiconductor package
JPS5325394A (en) Se miconductor device