JPS635636U - - Google Patents
Info
- Publication number
- JPS635636U JPS635636U JP1986098260U JP9826086U JPS635636U JP S635636 U JPS635636 U JP S635636U JP 1986098260 U JP1986098260 U JP 1986098260U JP 9826086 U JP9826086 U JP 9826086U JP S635636 U JPS635636 U JP S635636U
- Authority
- JP
- Japan
- Prior art keywords
- board
- lead
- integrated circuit
- printed wiring
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の構成の一例を示す斜視図、第
２図ａないしｆは基板の製造および実装手順を示
す説明図、第３図は本考案の他の実施例を示す斜
視図、第４図は更に他の実施例を示す断面図であ
る。第５図は従来例を示す斜視図である。
１……プリント配線基板、２……フレキシブル
基板、６……集積回路素子、７……接続部、９…
…開口部、１１……リード、１６……保持部。
FIG. 1 is a perspective view showing an example of the configuration of the present invention, FIGS. 2 a to f are explanatory diagrams showing the steps for manufacturing and mounting a board, and FIG. 3 is a perspective view showing another embodiment of the present invention. FIG. 4 is a sectional view showing still another embodiment. FIG. 5 is a perspective view showing a conventional example. DESCRIPTION OF SYMBOLS 1...Printed wiring board, 2...Flexible board, 6...Integrated circuit element, 7...Connection part, 9...
...opening, 11...lead, 16...holding part.
Claims (1)
応して基板に設けた開口部と、 基板上から開口部に向け、集積回路素子の接続
部に接合可能に延びる複数本のリードと、 各リードの先端位置を互いに固定する保持部と
から構成されるプリント配線基板。 前記保持部は薄板状であつて、リードの先端
部を下面側から支持する実用新案登録請求の範囲
第１項記載のプリント配線基板。[Scope of Claim for Utility Model Registration] A flexible board, an opening provided in the board corresponding to the connection part of the integrated circuit element to be mounted on the board, and a connection part of the integrated circuit element from the top of the board toward the opening. A printed wiring board consisting of a plurality of leads that extend so that they can be joined to each other, and a holding part that fixes the tip positions of each lead to each other. 2. The printed wiring board according to claim 1, wherein the holding portion is in the form of a thin plate and supports the tip end of the lead from the bottom side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986098260U JPS635636U (en) | 1986-06-26 | 1986-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986098260U JPS635636U (en) | 1986-06-26 | 1986-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS635636U true JPS635636U (en) | 1988-01-14 |
Family
ID=30966032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986098260U Pending JPS635636U (en) | 1986-06-26 | 1986-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS635636U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0888250A (en) * | 1994-09-20 | 1996-04-02 | Nec Corp | Tab tape and bonding method of tab inner lead |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010077A (en) * | 1973-05-23 | 1975-02-01 | ||
| JPS54119877A (en) * | 1978-03-09 | 1979-09-18 | Toshiba Corp | Semiconductor device |
-
1986
- 1986-06-26 JP JP1986098260U patent/JPS635636U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010077A (en) * | 1973-05-23 | 1975-02-01 | ||
| JPS54119877A (en) * | 1978-03-09 | 1979-09-18 | Toshiba Corp | Semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0888250A (en) * | 1994-09-20 | 1996-04-02 | Nec Corp | Tab tape and bonding method of tab inner lead |