JPH0173944U - - Google Patents
Info
- Publication number
- JPH0173944U JPH0173944U JP1987170623U JP17062387U JPH0173944U JP H0173944 U JPH0173944 U JP H0173944U JP 1987170623 U JP1987170623 U JP 1987170623U JP 17062387 U JP17062387 U JP 17062387U JP H0173944 U JPH0173944 U JP H0173944U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- semiconductor chip
- resin
- adhere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ａ，ｂは本考案の一実施例を示す斜視図
、第２図は従来例を示す斜視図である。
４：半導体チツプ、５：プリント基板、６：孔
、７：樹脂、８：端子。
1A and 1B are perspective views showing an embodiment of the present invention, and FIG. 2 is a perspective view showing a conventional example. 4: semiconductor chip, 5: printed circuit board, 6: hole, 7: resin, 8: terminal.
Claims (1)
性樹脂で封止させるプリント基板であつて、 前記樹脂の所望被着領域端部に予め複数個の孔
が形成されてなることを特徴とするプリント基板
。[Claims for Utility Model Registration] A printed circuit board on which a semiconductor chip is mounted and the semiconductor chip is sealed with a fluid resin, wherein a plurality of holes are formed in advance at the end of a desired area for the resin to adhere. A printed circuit board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987170623U JPH0173944U (en) | 1987-11-06 | 1987-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987170623U JPH0173944U (en) | 1987-11-06 | 1987-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0173944U true JPH0173944U (en) | 1989-05-18 |
Family
ID=31461726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987170623U Pending JPH0173944U (en) | 1987-11-06 | 1987-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0173944U (en) |
-
1987
- 1987-11-06 JP JP1987170623U patent/JPH0173944U/ja active Pending
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