JPS61153371U - - Google Patents
Info
- Publication number
- JPS61153371U JPS61153371U JP3795985U JP3795985U JPS61153371U JP S61153371 U JPS61153371 U JP S61153371U JP 3795985 U JP3795985 U JP 3795985U JP 3795985 U JP3795985 U JP 3795985U JP S61153371 U JPS61153371 U JP S61153371U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- land portion
- hole
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案によるプリント回路基板の一例
の要部の一方向断面図、第２図は同、他方向断面
図、第３図は同、プリント回路基板の一部分の平
面図、第４図は同、プリント回路基板に回路部品
を実装した状態の一部分の断面図、第５図は従来
のプリント回路基板の一部分の断面図、第６図は
同、プリント回路基板の半田デイツプ後の状態に
おける断面図である。
１は硬質プリント基板、３はランド部、３ａは
無孔部、４はスルーホール、５はフレキシブルプ
リント基板、６はベースフイルム、８は銅箔、１
３は半田付孔である。
FIG. 1 is a cross-sectional view in one direction of a main part of an example of a printed circuit board according to the present invention, FIG. 2 is a cross-sectional view in the same direction in the other direction, FIG. 3 is a plan view of a portion of the printed circuit board, and FIG. Figure 5 is a cross-sectional view of a part of a conventional printed circuit board, and Figure 6 is a cross-sectional view of a part of the printed circuit board after soldering. FIG. 1 is a rigid printed circuit board, 3 is a land portion, 3a is a non-porous portion, 4 is a through hole, 5 is a flexible printed circuit board, 6 is a base film, 8 is a copper foil, 1
3 is a soldering hole.
Claims (1)
を接合して成るプリント回路基板において、 上記硬質プリント基板のランド部に、上記フレ
キシブルプリント基板の半田付孔と対応する部位
の近傍に位置してスルーホールを設け、上記ラン
ド部の上記フレキシブルプリント基板の半田付孔
と対応する部位は無孔状としたことを特徴とする
プリント回路基板。[Scope of Claim for Utility Model Registration] In a printed circuit board formed by bonding a flexible printed circuit board to a rigid printed circuit board, a land portion of the rigid printed circuit board is located near a portion corresponding to a soldering hole of the flexible printed circuit board. A printed circuit board characterized in that a through hole is provided in the land portion, and a portion of the land portion corresponding to a soldering hole of the flexible printed circuit board is non-porous.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3795985U JPS61153371U (en) | 1985-03-15 | 1985-03-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3795985U JPS61153371U (en) | 1985-03-15 | 1985-03-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61153371U true JPS61153371U (en) | 1986-09-22 |
Family
ID=30544520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3795985U Pending JPS61153371U (en) | 1985-03-15 | 1985-03-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61153371U (en) |
-
1985
- 1985-03-15 JP JP3795985U patent/JPS61153371U/ja active Pending
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