JPS61146970U - - Google Patents
Info
- Publication number
- JPS61146970U JPS61146970U JP3002685U JP3002685U JPS61146970U JP S61146970 U JPS61146970 U JP S61146970U JP 3002685 U JP3002685 U JP 3002685U JP 3002685 U JP3002685 U JP 3002685U JP S61146970 U JPS61146970 U JP S61146970U
- Authority
- JP
- Japan
- Prior art keywords
- insertion hole
- circuit board
- printed circuit
- copper foil
- foil pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図ａは実施例のプリント基板の一部を示す
平面図、第１図ｂは図ａのＡ―Ａ線に沿つた断面
図、第２図ａは従来のプリント基板を示す平面図
、第２図ｂは図ａのＢ―Ｂ線に沿つた断面図であ
る。
１…プリント基板、２…端子挿入孔、３…銅箔
パターン。
FIG. 1a is a plan view showing a part of the printed circuit board of the embodiment, FIG. 1b is a sectional view taken along line AA in FIG. 2a, and FIG. 2a is a plan view showing a conventional printed circuit board. FIG. 2b is a sectional view taken along line BB in FIG. 2a. 1... Printed circuit board, 2... Terminal insertion hole, 3... Copper foil pattern.
Claims (1)
囲に銅箔パターンを形成してなるプリント基板に
おいて、 前記銅箔パターンの孔径を前記端子挿入孔の孔
径よりわずかに大きく形成してなるプリント基板
。[Scope of Claim for Utility Model Registration] A printed circuit board comprising a terminal insertion hole and a copper foil pattern formed around the insertion hole, wherein the hole diameter of the copper foil pattern is slightly larger than the hole diameter of the terminal insertion hole. Printed circuit board made by forming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3002685U JPS61146970U (en) | 1985-03-01 | 1985-03-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3002685U JPS61146970U (en) | 1985-03-01 | 1985-03-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61146970U true JPS61146970U (en) | 1986-09-10 |
Family
ID=30529354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3002685U Pending JPS61146970U (en) | 1985-03-01 | 1985-03-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61146970U (en) |
-
1985
- 1985-03-01 JP JP3002685U patent/JPS61146970U/ja active Pending