JPS6292672U - - Google Patents

Info

Publication number
JPS6292672U
JPS6292672U JP18419985U JP18419985U JPS6292672U JP S6292672 U JPS6292672 U JP S6292672U JP 18419985 U JP18419985 U JP 18419985U JP 18419985 U JP18419985 U JP 18419985U JP S6292672 U JPS6292672 U JP S6292672U
Authority
JP
Japan
Prior art keywords
perforations
wiring board
insulating substrate
conductor
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18419985U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18419985U priority Critical patent/JPS6292672U/ja
Publication of JPS6292672U publication Critical patent/JPS6292672U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例の平面図、第2図は従
来のプリント配線板の切断後の平面図、第3図は
本考案の実施例の切断後の平面図、第4図は本考
案の他実施例の平面図を示す。 11……絶縁基板、12……回路、13……ミ
シン目、14……導体。
Fig. 1 is a plan view of an embodiment of the present invention, Fig. 2 is a plan view of a conventional printed wiring board after cutting, Fig. 3 is a plan view of the embodiment of the present invention after cutting, and Fig. 4 is a plan view of a conventional printed wiring board after cutting. A plan view of another embodiment of the invention is shown. 11...Insulating board, 12...Circuit, 13...Perforation, 14...Conductor.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板にミシン目が設けられ、該ミシン目の
箇所で前記絶縁基板を複数個に分割しうるプリン
ト配線板において、ミシン目の箇所に所定巾の導
体が設けられていることを特徴とするプリント配
線板。
A printed wiring board in which an insulating substrate is provided with perforations, and the insulating substrate can be divided into a plurality of pieces at the perforations, wherein a conductor of a predetermined width is provided at the perforations. wiring board.
JP18419985U 1985-11-29 1985-11-29 Pending JPS6292672U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18419985U JPS6292672U (en) 1985-11-29 1985-11-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18419985U JPS6292672U (en) 1985-11-29 1985-11-29

Publications (1)

Publication Number Publication Date
JPS6292672U true JPS6292672U (en) 1987-06-13

Family

ID=31131646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18419985U Pending JPS6292672U (en) 1985-11-29 1985-11-29

Country Status (1)

Country Link
JP (1) JPS6292672U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02256289A (en) * 1989-03-29 1990-10-17 Fujitsu Ten Ltd Printed board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02256289A (en) * 1989-03-29 1990-10-17 Fujitsu Ten Ltd Printed board

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