JPS61162074U - - Google Patents
Info
- Publication number
- JPS61162074U JPS61162074U JP4610685U JP4610685U JPS61162074U JP S61162074 U JPS61162074 U JP S61162074U JP 4610685 U JP4610685 U JP 4610685U JP 4610685 U JP4610685 U JP 4610685U JP S61162074 U JPS61162074 U JP S61162074U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- printed circuit
- circuit board
- comb
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 description 2
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は従来のプリント基板同志の接合部分を
示す平面図。第２図は本考案実施例としてのプリ
ント基板の接合部の平面図であり、第２図ａは接
合部の切断前の状態を示し、第２図ｂは切断後の
状態を示し、第２図ｃはパターンずれを生じた状
態を示す。第３図は本考案実施例のプリント基板
の接合状態を示す平面図であり、第３図ａはパタ
ーンずれを生じていないプリント基板を用いた例
を示し、第３図ｂはパターンずれを生じているプ
リント基板を用いた例を示す。第４図は本考案の
他の実施例としてのプリント基板の接合状態を示
す平面図。
Ａ……プリント基板、５……接合部、１１……
フイルムベース、１５……接合パターン、１６…
…巾のせまい導体パターン、１７……導体パター
ン。
FIG. 1 is a plan view showing a joint between conventional printed circuit boards. FIG. 2 is a plan view of a joint part of a printed circuit board as an embodiment of the present invention, FIG. 2a shows the state of the joint before cutting, FIG. 2b shows the state after cutting, and Figure c shows a state in which a pattern shift occurs. FIG. 3 is a plan view showing the bonded state of the printed circuit board according to the embodiment of the present invention, FIG. 3 a shows an example using a printed circuit board with no pattern deviation, and FIG. An example using a printed circuit board is shown below. FIG. 4 is a plan view showing a bonded state of printed circuit boards as another embodiment of the present invention. A...Printed circuit board, 5...Joint part, 11...
Film base, 15... Bonding pattern, 16...
...Narrow conductor pattern, 17...Conductor pattern.
Claims (1)
し、この接合端部を該接合パターンが突出するよ
うにくし歯状に切断したプリント基板の接合部構
造において、くし歯状に突出した前記接合パター
ンの基部を巾せまいパターンに形成したことを特
徴とするプリント基板の接合部構造。 A printed circuit board bonding structure in which a plurality of bonding patterns are formed on an insulating base and the bonding ends are cut into a comb-like shape such that the bonding patterns protrude, the bonding patterns protruding in a comb-like shape. A printed circuit board joint structure characterized by having a base formed in a narrow pattern.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4610685U JPS61162074U (en) | 1985-03-29 | 1985-03-29 | |
| US06/844,822 US4795079A (en) | 1985-03-29 | 1986-03-27 | Structure of joining printed circuit boards and process for producing the same |
| US07/282,949 US4950527A (en) | 1985-03-29 | 1988-12-05 | Structure of joining printed circuit boards and process for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4610685U JPS61162074U (en) | 1985-03-29 | 1985-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61162074U true JPS61162074U (en) | 1986-10-07 |
Family
ID=30560197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4610685U Pending JPS61162074U (en) | 1985-03-29 | 1985-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61162074U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017203559A1 (en) * | 2016-05-23 | 2017-11-30 | 新電元工業株式会社 | Printed circuit board joining method, electronic device, and method for producing same |
-
1985
- 1985-03-29 JP JP4610685U patent/JPS61162074U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017203559A1 (en) * | 2016-05-23 | 2017-11-30 | 新電元工業株式会社 | Printed circuit board joining method, electronic device, and method for producing same |
| JPWO2017203559A1 (en) * | 2016-05-23 | 2018-06-07 | 新電元工業株式会社 | Printed circuit board bonding method, electronic device and manufacturing method thereof |
| US11032907B2 (en) | 2016-05-23 | 2021-06-08 | Shindengen Electric Manufacturing Co., Ltd. | Manufacturing method for electronic apparatus with case in which printed boards joined to each other are stored |