JPS62197875U - - Google Patents
Info
- Publication number
- JPS62197875U JPS62197875U JP8735786U JP8735786U JPS62197875U JP S62197875 U JPS62197875 U JP S62197875U JP 8735786 U JP8735786 U JP 8735786U JP 8735786 U JP8735786 U JP 8735786U JP S62197875 U JPS62197875 U JP S62197875U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- board
- assembled printed
- parting line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 239000002699 waste material Substances 0.000 claims 2
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Description
第１図は本考案の第１実施例の平面図、第２図
は第２実施例の平面図、第３図は第３実施例の平
面図、第４図は従来のプリント基板の分割状態を
示す平面図をそれぞれ示す。
３……捨基板、４……回路基板、１……透孔、
２……導体パターン。
Fig. 1 is a plan view of the first embodiment of the present invention, Fig. 2 is a plan view of the second embodiment, Fig. 3 is a plan view of the third embodiment, and Fig. 4 is a divided state of a conventional printed circuit board. A plan view showing each is shown. 3...Discarded board, 4...Circuit board, 1...Through hole,
2... Conductor pattern.
Claims (1)
を形成して成るプリント基板に於て、前記分割線
を境界として前記捨基板側の両面又は片面に補強
用の導体パターンを形成することを特徴とする集
合プリント基板。 (2) 前記導体パターン上に半田レジスト層が形
成されていないことを特徴とする実用新案登録請
求の範囲第１項記載の集合プリント基板。 (3) 前記透孔は内周に導体パターンを形成して
いることを特徴とする実用新案登録請求の範囲第
２項記載の集合プリント基板。[Claims for Utility Model Registration] (1) In a printed circuit board having a through hole formed on a parting line between a waste board and a wiring board, both or one side of the waste board side with the parting line as a boundary An assembled printed circuit board characterized by forming a reinforcing conductor pattern on the board. (2) The assembled printed circuit board according to claim 1, wherein a solder resist layer is not formed on the conductive pattern. (3) The assembled printed circuit board according to claim 2, wherein the through hole has a conductive pattern formed on its inner periphery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8735786U JPS62197875U (en) | 1986-06-09 | 1986-06-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8735786U JPS62197875U (en) | 1986-06-09 | 1986-06-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62197875U true JPS62197875U (en) | 1987-12-16 |
Family
ID=30944488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8735786U Pending JPS62197875U (en) | 1986-06-09 | 1986-06-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62197875U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05276291A (en) * | 1992-03-25 | 1993-10-22 | Tokyo Electric Co Ltd | Electronic blackboard device |
| JPH09107159A (en) * | 1996-10-07 | 1997-04-22 | Hokuriku Electric Ind Co Ltd | Circuit board and method of manufacture |
| JP2010287770A (en) * | 2009-06-12 | 2010-12-24 | Mitsubishi Electric Corp | Printed circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5729180B2 (en) * | 1973-11-27 | 1982-06-21 |
-
1986
- 1986-06-09 JP JP8735786U patent/JPS62197875U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5729180B2 (en) * | 1973-11-27 | 1982-06-21 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05276291A (en) * | 1992-03-25 | 1993-10-22 | Tokyo Electric Co Ltd | Electronic blackboard device |
| JPH09107159A (en) * | 1996-10-07 | 1997-04-22 | Hokuriku Electric Ind Co Ltd | Circuit board and method of manufacture |
| JP2010287770A (en) * | 2009-06-12 | 2010-12-24 | Mitsubishi Electric Corp | Printed circuit board |
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