JPS6430878U - - Google Patents
Info
- Publication number
- JPS6430878U JPS6430878U JP12590287U JP12590287U JPS6430878U JP S6430878 U JPS6430878 U JP S6430878U JP 12590287 U JP12590287 U JP 12590287U JP 12590287 U JP12590287 U JP 12590287U JP S6430878 U JPS6430878 U JP S6430878U
- Authority
- JP
- Japan
- Prior art keywords
- sealed
- wiring board
- sealing resin
- insulating substrate
- chip component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例の配線基板の要部を
示す図であり、第２図は従来の配線基板の要部を
示す図である。
１１……絶縁基板、１２，１３……配線パター
ン、１４……スルーホール、１５……栓体、１６
……チツプ部品、１７……ワイヤー、１８……封
止樹脂、１９……チツプ部品。
FIG. 1 is a diagram showing the main parts of a wiring board according to an embodiment of the present invention, and FIG. 2 is a diagram showing the main parts of a conventional wiring board. 11... Insulating board, 12, 13... Wiring pattern, 14... Through hole, 15... Plug, 16
... Chip parts, 17 ... Wire, 18 ... Sealing resin, 19 ... Chip parts.
Claims (1)
ターンを形成し、その一面にチツプ部品を取り付
け、そのチツプ部品を封止樹脂にて封止してなる
配線基板であつて、 その封止樹脂の存在する位置に形成されたスル
ーホールをあらかじめ栓体にて封塞してなること
を特徴とする配線基板。[Scope of Claim for Utility Model Registration] A wiring board in which a wiring pattern is formed on both sides of an insulating substrate via through holes, a chip component is attached to one side of the insulating substrate, and the chip component is sealed with a sealing resin. A wiring board characterized in that the through hole formed at the position where the sealing resin is present is sealed in advance with a plug.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12590287U JPS6430878U (en) | 1987-08-19 | 1987-08-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12590287U JPS6430878U (en) | 1987-08-19 | 1987-08-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6430878U true JPS6430878U (en) | 1989-02-27 |
Family
ID=31376919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12590287U Pending JPS6430878U (en) | 1987-08-19 | 1987-08-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6430878U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0566996U (en) * | 1992-02-07 | 1993-09-03 | ソニー株式会社 | Semiconductor device |
-
1987
- 1987-08-19 JP JP12590287U patent/JPS6430878U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0566996U (en) * | 1992-02-07 | 1993-09-03 | ソニー株式会社 | Semiconductor device |