JPS6371570U - - Google Patents
Info
- Publication number
- JPS6371570U JPS6371570U JP16700786U JP16700786U JPS6371570U JP S6371570 U JPS6371570 U JP S6371570U JP 16700786 U JP16700786 U JP 16700786U JP 16700786 U JP16700786 U JP 16700786U JP S6371570 U JPS6371570 U JP S6371570U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- wiring board
- pad
- mounting structure
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図及び第２図は本考案の電子部品の実装構
造の全体構成を示す斜視図及び部分拡大図、第３
図は従来の電子部品の実装構造の全体構成を示す
斜視図である。
１……ＬＳＩパツケージ（電子部品）、２，２
ａ……リード、３，３ａ……パツド、４……配線
基板、４ａ……配線基板表面、５……スルーホー
ル。
1 and 2 are a perspective view and a partially enlarged view showing the overall configuration of the electronic component mounting structure of the present invention;
The figure is a perspective view showing the overall configuration of a conventional electronic component mounting structure. 1...LSI package (electronic component), 2,2
a... Lead, 3, 3a... Pad, 4... Wiring board, 4a... Wiring board surface, 5... Through hole.
Claims (1)
３に固着される複数のリード２を備えた電子部品
において、 上記リード２のうち任意のリード２ａを下方向
に延長する如く成形し、上記配線基板４に形成さ
れたスルーホール５に貫入して位置決めを行なう
ようにしたことを特徴とする電子部品の実装構造
。 (2) スルーホール５は、下方向に成形されたリ
ード２ａが固着されるべきパツド３ａの一部を介
して貫通し、当該リード２ａは当該パツド３ａに
半田付けされて成ることを特徴とする実用新案登
録請求の範囲第１項記載の電子部品の実装構造。[Claims for Utility Model Registration] (1) In an electronic component equipped with a plurality of leads 2 fixed to a pad 3 provided on a surface 4a of a wiring board 4, any one of the leads 2 is directed downward. 1. A mounting structure for electronic components, characterized in that the electronic component is formed so as to extend into the wiring board 4, and is inserted into a through hole 5 formed in the wiring board 4 for positioning. (2) The through hole 5 is characterized in that the lead 2a molded downward passes through a part of the pad 3a to which it is to be fixed, and the lead 2a is soldered to the pad 3a. A mounting structure for an electronic component according to claim 1 of the utility model registration claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16700786U JPS6371570U (en) | 1986-10-30 | 1986-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16700786U JPS6371570U (en) | 1986-10-30 | 1986-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6371570U true JPS6371570U (en) | 1988-05-13 |
Family
ID=31098529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16700786U Pending JPS6371570U (en) | 1986-10-30 | 1986-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6371570U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01303785A (en) * | 1988-06-01 | 1989-12-07 | Hitachi Ltd | Connection structure of multi-terminal electronic component |
-
1986
- 1986-10-30 JP JP16700786U patent/JPS6371570U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01303785A (en) * | 1988-06-01 | 1989-12-07 | Hitachi Ltd | Connection structure of multi-terminal electronic component |