JPH0351861U - - Google Patents

Info

Publication number
JPH0351861U
JPH0351861U JP11214889U JP11214889U JPH0351861U JP H0351861 U JPH0351861 U JP H0351861U JP 11214889 U JP11214889 U JP 11214889U JP 11214889 U JP11214889 U JP 11214889U JP H0351861 U JPH0351861 U JP H0351861U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
substrate
board substrate
notch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11214889U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11214889U priority Critical patent/JPH0351861U/ja
Publication of JPH0351861U publication Critical patent/JPH0351861U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図及び第２図は本考案の一実施例を示し、
第１図は印刷配線板の基板の平面図、第２図は同
基板の断面図であり、第３図及び第４図は従来例
を示し、第３図は印刷配線板の基板の平面図、第
４図は同基板の断面図である。 １……印刷配線板、７……樹脂、８……ベアチ
ツプＩＣ、１０……基板、１４……切欠部。 1 and 2 show an embodiment of the present invention,
Fig. 1 is a plan view of the substrate of the printed wiring board, Fig. 2 is a sectional view of the same board, Figs. 3 and 4 show conventional examples, and Fig. 3 is a plan view of the substrate of the printed wiring board. , FIG. 4 is a sectional view of the same substrate. DESCRIPTION OF SYMBOLS 1...Printed wiring board, 7...Resin, 8...Bare chip IC, 10...Substrate, 14...Notch.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 印刷配線板の基板に於て、該基板に搭載した回
路素子へ樹脂をポツテイングすべき部位の縁部に
切欠部を設けたことを特徴とする印刷配線板の基
板。 1. A printed wiring board substrate, characterized in that a notch is provided at the edge of a portion of the printed wiring board substrate where a resin is to be potted onto a circuit element mounted on the substrate.
JP11214889U 1989-09-26 1989-09-26 Pending JPH0351861U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11214889U JPH0351861U (en) 1989-09-26 1989-09-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11214889U JPH0351861U (en) 1989-09-26 1989-09-26

Publications (1)

Publication Number Publication Date
JPH0351861U true JPH0351861U (en) 1991-05-20

Family

ID=31660599

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11214889U Pending JPH0351861U (en) 1989-09-26 1989-09-26

Country Status (1)

Country Link
JP (1) JPH0351861U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008107061A (en) * 2006-10-27 2008-05-08 Toshiba Corp Air-conditioning duct straightening plate slit, constructing method of air-conditioning duct straightening plate slit and radioactive substance storage building

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS647689A (en) * 1987-06-30 1989-01-11 Shinwa Print Kogyo Kk Processing of printed wiring board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS647689A (en) * 1987-06-30 1989-01-11 Shinwa Print Kogyo Kk Processing of printed wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008107061A (en) * 2006-10-27 2008-05-08 Toshiba Corp Air-conditioning duct straightening plate slit, constructing method of air-conditioning duct straightening plate slit and radioactive substance storage building

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