JPS647689A - Processing of printed wiring board - Google Patents

Processing of printed wiring board

Info

Publication number
JPS647689A
JPS647689A JP16339887A JP16339887A JPS647689A JP S647689 A JPS647689 A JP S647689A JP 16339887 A JP16339887 A JP 16339887A JP 16339887 A JP16339887 A JP 16339887A JP S647689 A JPS647689 A JP S647689A
Authority
JP
Japan
Prior art keywords
hole
drilled
same diameter
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16339887A
Other languages
Japanese (ja)
Other versions
JPH0770809B2 (en
Inventor
Yukio Fujisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHINWA PRINT KOGYO KK
Original Assignee
SHINWA PRINT KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHINWA PRINT KOGYO KK filed Critical SHINWA PRINT KOGYO KK
Priority to JP62163398A priority Critical patent/JPH0770809B2/en
Publication of JPS647689A publication Critical patent/JPS647689A/en
Publication of JPH0770809B2 publication Critical patent/JPH0770809B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Abstract

PURPOSE:To facilitate the decision of a drill diameter at time of drilling a hole in the printed wiring board, improving a working coefficient, and prevent the occurrence of defective products due to erroneous selection of a drill, by processing other different diameters of through holes after a through-hole having the same diameter is drilled continuously and then a through-hole having the same diameter of the above through-hole is drilled in the dummy section. CONSTITUTION:Many through-holes 11 with different diameters are drilled in a printed wiring board 1 which a conductive circuit 9 is formed at least on its one surface and which has a dummy section 4 separated after parts are loaded. In this case, the through-hole 11 having the same diameter is drilled continuously and the through hole 30 having the same diameter of the through- hole 11 is drilled in the dummy section 4, thereafter repeating the process where the drilling of through-holes having other different diameters is started. As this facilitates the confirmation of a hole diameter to be processed next, the corresponding drill can be selected without fail, resulting in improved working coefficient, and the defective products can be prevented from occurring, resulting in improved productivity.
JP62163398A 1987-06-30 1987-06-30 Printed wiring board Expired - Lifetime JPH0770809B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62163398A JPH0770809B2 (en) 1987-06-30 1987-06-30 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62163398A JPH0770809B2 (en) 1987-06-30 1987-06-30 Printed wiring board

Publications (2)

Publication Number Publication Date
JPS647689A true JPS647689A (en) 1989-01-11
JPH0770809B2 JPH0770809B2 (en) 1995-07-31

Family

ID=15773135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62163398A Expired - Lifetime JPH0770809B2 (en) 1987-06-30 1987-06-30 Printed wiring board

Country Status (1)

Country Link
JP (1) JPH0770809B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0351861U (en) * 1989-09-26 1991-05-20

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61284359A (en) * 1985-06-07 1986-12-15 Mutoh Ind Ltd Method for automatic division of hole mark coordinate data
JPS6268212A (en) * 1985-09-19 1987-03-28 Fujitsu Ltd Drilling method for multi layer printed substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61284359A (en) * 1985-06-07 1986-12-15 Mutoh Ind Ltd Method for automatic division of hole mark coordinate data
JPS6268212A (en) * 1985-09-19 1987-03-28 Fujitsu Ltd Drilling method for multi layer printed substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0351861U (en) * 1989-09-26 1991-05-20

Also Published As

Publication number Publication date
JPH0770809B2 (en) 1995-07-31

Similar Documents

Publication Publication Date Title
EP0028657A4 (en) Hollow multilayer printed wiring board, and method of fabricating same.
GB2018643B (en) Twist drill made of hard metal in particular for the drilling of printed circuit boards
JPS647689A (en) Processing of printed wiring board
IE802648L (en) Electrical component
JPH02218507A (en) Boring method for printed wiring board
GB1042234A (en) Multilayer printed circuits
JPS6467995A (en) Manufacture of printed circuit board with side face electrode
Mueller Circuit board production with the additive process.
JPS6451295A (en) Manufacture of printed wiring board
JPS6437073A (en) Printed board
JPS6410634A (en) Semiconductor integrated circuit device
JPH0464278A (en) Manufacture of printed wiring board
JPS6459991A (en) Manufacture of printed wiring board
JPS6424492A (en) Coil device
JPS6484793A (en) Formation of through hole in multilayer printed wiring board
JPS6317563B2 (en)
Mansveld et al. Manufacturing Printed Circuits Using the PD-R Process
JPS5619105A (en) Numeric control drilling machine for printed board drilling
JPS5627753A (en) Part mounting method and device for printed board
JPH0548240A (en) Manufacture of printed-wiring board
Flaig Experiences With Silk Screen Manufacturing for PC Printing
JPS51142176A (en) Method of drilling a small hole
JPS5750645A (en) Method for inspecting pattern of printed wiring board
JPS57205010A (en) Hole drilling process for printed board
ARZIGIAN Laser drilling of printed wiring boards: Sandia LDRD program(Final Report)