JPS5750645A - Method for inspecting pattern of printed wiring board - Google Patents

Method for inspecting pattern of printed wiring board

Info

Publication number
JPS5750645A
JPS5750645A JP12597680A JP12597680A JPS5750645A JP S5750645 A JPS5750645 A JP S5750645A JP 12597680 A JP12597680 A JP 12597680A JP 12597680 A JP12597680 A JP 12597680A JP S5750645 A JPS5750645 A JP S5750645A
Authority
JP
Japan
Prior art keywords
parts
patterns
reflectivity
resist
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12597680A
Other languages
Japanese (ja)
Inventor
Koichi Tsukazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12597680A priority Critical patent/JPS5750645A/en
Publication of JPS5750645A publication Critical patent/JPS5750645A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To surely inspect the wiring patterns prior to etching by subjecting the parts of copper other than the etching parts for forming wiring patterns to oxidation treatment, and increasing the difference in reflectivity of both parts. CONSTITUTION:When the parts of copper 10 other than the wiring pattern parts constituted by resist 12 are subjected to oxidation treatment with an oxidizing soln. prepd. by mixing NaOH, K2S2O6, NaCeO, H2O, etc. at prescribed ratios, the reflectivity in the part of the copper 10' decreases, thereby producing a large difference in the reflectivity from the pattern parts of the resist 12. Hence, the defectiveness and non-defectiveness of the patterns of the unetched resist 12 are surely inspected by A/D conversion or the like of the difference in the detected value for reflected light. If necessary, it is possible to reproduce the printed wiring board by correcting the etching patterns.
JP12597680A 1980-09-12 1980-09-12 Method for inspecting pattern of printed wiring board Pending JPS5750645A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12597680A JPS5750645A (en) 1980-09-12 1980-09-12 Method for inspecting pattern of printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12597680A JPS5750645A (en) 1980-09-12 1980-09-12 Method for inspecting pattern of printed wiring board

Publications (1)

Publication Number Publication Date
JPS5750645A true JPS5750645A (en) 1982-03-25

Family

ID=14923641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12597680A Pending JPS5750645A (en) 1980-09-12 1980-09-12 Method for inspecting pattern of printed wiring board

Country Status (1)

Country Link
JP (1) JPS5750645A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0231941A2 (en) * 1986-02-05 1987-08-12 OMRON Corporation Method for inspection of printed circuit board assembly by arithmetic comparison of several pictures in different colours
US5633121A (en) * 1993-04-21 1997-05-27 Fujitsu Limited Method for examining surface of copper layer in circuit board and process for producing circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0231941A2 (en) * 1986-02-05 1987-08-12 OMRON Corporation Method for inspection of printed circuit board assembly by arithmetic comparison of several pictures in different colours
US5633121A (en) * 1993-04-21 1997-05-27 Fujitsu Limited Method for examining surface of copper layer in circuit board and process for producing circuit board

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