JPS6484785A - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
JPS6484785A
JPS6484785A JP24325387A JP24325387A JPS6484785A JP S6484785 A JPS6484785 A JP S6484785A JP 24325387 A JP24325387 A JP 24325387A JP 24325387 A JP24325387 A JP 24325387A JP S6484785 A JPS6484785 A JP S6484785A
Authority
JP
Japan
Prior art keywords
land
teardrop
line
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24325387A
Other languages
Japanese (ja)
Other versions
JP2519068B2 (en
Inventor
Mikio Mori
Keiichiro Imaki
Hajime Hosokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP62243253A priority Critical patent/JP2519068B2/en
Publication of JPS6484785A publication Critical patent/JPS6484785A/en
Application granted granted Critical
Publication of JP2519068B2 publication Critical patent/JP2519068B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To obtain a highly reliable printed wiring board where a high-density wiring part can be formed near a land having a teardrop by a method wherein the teardrop is formed only on one side of a part where a line is formed with reference to the land. CONSTITUTION:A teardrop 13 is formed in order to enhance reliability at a connection part between a line 11 and a land 12 and is formed only on one side of the connection part between the line 11 and the land 12. That is to say, the teardrop 13 is not formed positively on the side in a part where the line 11 is connected to the land but other wiring patterns 14 are formed; by this setup, a space to form the other wiring patterns 14 can be secured sufficiently. In addition, if the teardrop 13 is added to only one side extering the land 12, i.e., a part where the other wiring patterns 14 do not exist, reliability of a connection between the line 11 and the land 12 can be enhanced.
JP62243253A 1987-09-28 1987-09-28 Printed wiring board Expired - Lifetime JP2519068B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62243253A JP2519068B2 (en) 1987-09-28 1987-09-28 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62243253A JP2519068B2 (en) 1987-09-28 1987-09-28 Printed wiring board

Publications (2)

Publication Number Publication Date
JPS6484785A true JPS6484785A (en) 1989-03-30
JP2519068B2 JP2519068B2 (en) 1996-07-31

Family

ID=17101120

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62243253A Expired - Lifetime JP2519068B2 (en) 1987-09-28 1987-09-28 Printed wiring board

Country Status (1)

Country Link
JP (1) JP2519068B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078249A (en) * 2001-09-06 2003-03-14 Fujitsu Ten Ltd Multilayer board structure

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5622151A (en) * 1979-07-31 1981-03-02 Fujitsu Ltd Branch address recording system
JPS57161269U (en) * 1981-04-03 1982-10-09
JPS5818363U (en) * 1981-07-27 1983-02-04 日立電子株式会社 metal thin film wiring
JPS5857236A (en) * 1981-09-30 1983-04-05 松下電工株式会社 Electronic circuit built-in relay
JPS60167360U (en) * 1984-04-16 1985-11-06 キヤノン株式会社 Circuit board for controlling electrical equipment
JPS6163863U (en) * 1984-09-29 1986-04-30
JPS6378396U (en) * 1986-11-12 1988-05-24

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3903199A (en) * 1974-03-07 1975-09-02 Monsanto Co Continuous mass polymerization process for ABS polymeric polyblends

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5622151A (en) * 1979-07-31 1981-03-02 Fujitsu Ltd Branch address recording system
JPS57161269U (en) * 1981-04-03 1982-10-09
JPS5818363U (en) * 1981-07-27 1983-02-04 日立電子株式会社 metal thin film wiring
JPS5857236A (en) * 1981-09-30 1983-04-05 松下電工株式会社 Electronic circuit built-in relay
JPS60167360U (en) * 1984-04-16 1985-11-06 キヤノン株式会社 Circuit board for controlling electrical equipment
JPS6163863U (en) * 1984-09-29 1986-04-30
JPS6378396U (en) * 1986-11-12 1988-05-24

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078249A (en) * 2001-09-06 2003-03-14 Fujitsu Ten Ltd Multilayer board structure

Also Published As

Publication number Publication date
JP2519068B2 (en) 1996-07-31

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