JPS6424491A - Printed board - Google Patents

Printed board

Info

Publication number
JPS6424491A
JPS6424491A JP17990687A JP17990687A JPS6424491A JP S6424491 A JPS6424491 A JP S6424491A JP 17990687 A JP17990687 A JP 17990687A JP 17990687 A JP17990687 A JP 17990687A JP S6424491 A JPS6424491 A JP S6424491A
Authority
JP
Japan
Prior art keywords
smd
land
hole
wiring pattern
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17990687A
Other languages
Japanese (ja)
Other versions
JPH0821764B2 (en
Inventor
Takeo Takahashi
Kazuo Doi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Canon Components Inc
Original Assignee
Canon Inc
Canon Components Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc, Canon Components Inc filed Critical Canon Inc
Priority to JP17990687A priority Critical patent/JPH0821764B2/en
Publication of JPS6424491A publication Critical patent/JPS6424491A/en
Publication of JPH0821764B2 publication Critical patent/JPH0821764B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Abstract

PURPOSE:To make a wiring pattern section small in area so as not only to increase a component mounting in density but also enable a assured soldering of a SMD to a land by a method wherein a through-hole, filled with solder, of which one side is covered and the other side is adhered to a SMD is provided in a surface mounting device (SMD) land. CONSTITUTION:For instance, wiring patterns 104 and 105 and film resists 105 and 205 are formed on a front and a rear face of a substrate 1 respectively, where the wiring pattern 104 on the front side and the pattern 204 on the rear side are connected with each other through holes 8 and 9. And, SMD lands 103a and 103b are provided on the front face of the substrate 1. The through- hole 8 connecting the SMD land 103a with the wiring pattern 204 on the rear side is positioned just under the SMD land 103a, and its inside is filled with solder and its rear entrance is covered with the film resist 205. With this structure, a cream solder 7 is prevented from flowing into the through-hole 8, so that a SMD 2 is soldered in a excellent condition.
JP17990687A 1987-07-21 1987-07-21 Printed board Expired - Lifetime JPH0821764B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17990687A JPH0821764B2 (en) 1987-07-21 1987-07-21 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17990687A JPH0821764B2 (en) 1987-07-21 1987-07-21 Printed board

Publications (2)

Publication Number Publication Date
JPS6424491A true JPS6424491A (en) 1989-01-26
JPH0821764B2 JPH0821764B2 (en) 1996-03-04

Family

ID=16073976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17990687A Expired - Lifetime JPH0821764B2 (en) 1987-07-21 1987-07-21 Printed board

Country Status (1)

Country Link
JP (1) JPH0821764B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02256296A (en) * 1989-03-29 1990-10-17 Japan Radio Co Ltd Method of filling through-hole of printed circuit board with solder
JPH02266590A (en) * 1989-04-07 1990-10-31 Fujitsu Ltd Surface-mounting printed substrate
JPH05146352A (en) * 1991-11-26 1993-06-15 Tiger Vacuum Bottle Co Ltd Rice cooking jar and method for judging capacity of rice to be cooked
US5243142A (en) * 1990-08-03 1993-09-07 Hitachi Aic Inc. Printed wiring board and process for producing the same
US5319159A (en) * 1992-12-15 1994-06-07 Sony Corporation Double-sided printed wiring board and method of manufacture thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02256296A (en) * 1989-03-29 1990-10-17 Japan Radio Co Ltd Method of filling through-hole of printed circuit board with solder
JPH02266590A (en) * 1989-04-07 1990-10-31 Fujitsu Ltd Surface-mounting printed substrate
US5243142A (en) * 1990-08-03 1993-09-07 Hitachi Aic Inc. Printed wiring board and process for producing the same
JPH05146352A (en) * 1991-11-26 1993-06-15 Tiger Vacuum Bottle Co Ltd Rice cooking jar and method for judging capacity of rice to be cooked
US5319159A (en) * 1992-12-15 1994-06-07 Sony Corporation Double-sided printed wiring board and method of manufacture thereof

Also Published As

Publication number Publication date
JPH0821764B2 (en) 1996-03-04

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Legal Events

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