JPH0143877Y2 - - Google Patents
Info
- Publication number
- JPH0143877Y2 JPH0143877Y2 JP1983090364U JP9036483U JPH0143877Y2 JP H0143877 Y2 JPH0143877 Y2 JP H0143877Y2 JP 1983090364 U JP1983090364 U JP 1983090364U JP 9036483 U JP9036483 U JP 9036483U JP H0143877 Y2 JPH0143877 Y2 JP H0143877Y2
- Authority
- JP
- Japan
- Prior art keywords
- board
- hole
- sided
- double
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Description
【考案の詳細な説明】
産業上の利用分野
本考案は、アース板として導電層を有するプリ
ント基板に関するものである。[Detailed Description of the Invention] Industrial Application Field The present invention relates to a printed circuit board having a conductive layer as a ground plate.
背景技術とその問題点
両面が実装されたプリント基板における基板両
面間のクロストーク等を防止するため、近年プリ
ント基板加工技術の向上により第１図に示すよう
な３層基板が用いられている。第１図において、
１′はＡ面基板部分、２′はＢ面基板部分、３はＡ
面に装着された部品、４はＢ面に装着された部
品、５は導電層（アース板）、６はスルーホール
めつき部を示す。スルーホールめつき部６は、銅
めつき等によりＡ，Ｂ両面のアース・パターン
（図示を省略）とアース板５を電気的に接続する
ものである。アース板５は、通常銅箔で形成され
ている。しかし、かような３層基板は、まだ生産
性がよくないため、非常に高価で且つ製造に多く
の日数を要するのが現状である。また、スルーホ
ールめつき部６の信頼性も低い。BACKGROUND TECHNOLOGY AND PROBLEMS In order to prevent crosstalk between both sides of a printed circuit board in which both sides are mounted, a three-layer board as shown in FIG. 1 has been used in recent years due to improvements in printed circuit board processing technology. In Figure 1,
1' is the A side board part, 2' is the B side board part, 3 is the A side board part.
Components attached to the surface, 4 are components attached to the B side, 5 is a conductive layer (earth plate), and 6 is a through-hole plating part. The through-hole plating portion 6 electrically connects the grounding pattern (not shown) on both sides A and B to the grounding plate 5 by copper plating or the like. The ground plate 5 is usually made of copper foil. However, the productivity of such a three-layer board is still not good, and the current situation is that it is very expensive and takes many days to manufacture. Furthermore, the reliability of the through-hole plating portion 6 is also low.
考案の目的
本考案は、Ａ，Ｂ両面間のクロストーク等を防
止するためのアース板を安価に且つ簡単に基板内
に形成しうるプリント基板を提供することを目的
とする。Purpose of the invention The object of the invention is to provide a printed circuit board in which a grounding plate for preventing crosstalk between both surfaces A and B can be easily and inexpensively formed within the board.
考案の概要
本考案は、両面基板と片面基板又は２枚の両面
基板を用い、両面基板の内側の面に形成された導
電層をアース板とし、このアース板と２枚の基板
の外側の面に形成されたアース・パターンとをス
ルーホール・ピンを介して半田付けすることによ
り、上記の目的を達成したものである。Summary of the invention This invention uses a double-sided board and a single-sided board or two double-sided boards, uses a conductive layer formed on the inner surface of the double-sided board as a grounding plate, and connects this grounding plate and the outer surfaces of the two boards. The above object is achieved by soldering the ground pattern formed on the ground through a through-hole pin.
実施例
第２及び第３図は本考案の好適な実施例を示す
一部断面図で、第２図は半田付け前の状態、第３
図は半田付け後の状態を示すものである。これら
の図において、第１図と対応する部分には同一の
又は類似の符号を付してある。１は両面基板、２
は片面基板、１1，２1はそれぞれ両面基板１と片
面基板２の外側の面に設けられたアース・パター
ン、１2，２2はそれぞれ両基板１，２に設けられ
た径の異なる貫通孔を示す。両面基板１は、パタ
ーン形成面と反対の内側の面に導電層５がアース
板として形成され、片面基板２は、外側の面のみ
にパターンが形成されている。本実施例では、両
面基板と片面基板の２枚の基板を用いているが、
２枚の両面基板を用いることもできる。両面基板
１の貫通孔１2は、これに挿通する導電性スルー
ホール・ピン７の径とほぼ同径とするが、片面基
板２の貫通孔２2は、半田がアース板５に付着し
易いように、貫通孔１2より外径をやや大きくす
ると共に貫通孔１2がほぼ中央に来るような位置
とする。Embodiment FIGS. 2 and 3 are partial cross-sectional views showing a preferred embodiment of the present invention. FIG. 2 is a state before soldering, and FIG.
The figure shows the state after soldering. In these figures, parts corresponding to those in FIG. 1 are given the same or similar symbols. 1 is a double-sided board, 2
are single-sided boards, 1 1 and 2 1 are ground patterns provided on the outer surfaces of double-sided board 1 and single-sided board 2, respectively, and 1 2 and 2 2 are through holes with different diameters provided on both boards 1 and 2, respectively. Shows holes. The double-sided substrate 1 has a conductive layer 5 formed as a ground plate on the inner surface opposite to the pattern-formed surface, and the single-sided substrate 2 has a pattern formed only on the outer surface. In this example, two boards, a double-sided board and a single-sided board, are used.
Two double-sided substrates can also be used. The through-hole 1 2 of the double-sided board 1 is made to have approximately the same diameter as the conductive through-hole pin 7 inserted therein, but the through-hole 2 2 of the single-sided board 2 is easy for solder to adhere to the ground plate 5. Thus, the outer diameter is made slightly larger than that of the through hole 1 2 and the through hole 1 2 is positioned approximately in the center.
製造に際しては、まず、スルーホール・ピン７
を両面基板１の貫通孔１2に挿通し、半田８によ
りピン７をアース・パターン１1と接合する。次
に、半田９によりピン７とアース板５及び片面基
板２のアース・パターン２1とを接合する。こう
すると、基板の外側の両面のアース・パターン１
１，２1が共通のアース板５に電気的に接続される
と共に、両面基板１と片面基板２とは機械的にも
結合固定される。この場合、半田付け方法は任意
としうる。例えば、半田８は手半田により、ま
た、半田９はデイツプ半田によつて行なうことも
できる。 During manufacturing, first, through-hole pin 7
is inserted into the through hole 12 of the double-sided board 1, and the pin 7 is connected to the ground pattern 11 with solder 8. Next, the pin 7 is joined to the ground plate 5 and the ground pattern 2 1 of the single-sided board 2 using solder 9 . This will ensure that the ground pattern 1 on both sides of the outside of the board
1 and 2 1 are electrically connected to a common ground plate 5, and the double-sided substrate 1 and the single-sided substrate 2 are also mechanically coupled and fixed. In this case, the soldering method may be arbitrary. For example, the soldering 8 can be done by hand soldering, and the soldering 9 can be done by dip soldering.
上記の実施例においては、両面基板と片面基板
を用いた場合を示したが、前述のように２枚の両
面基板を用い両基板間においてアース板を背中合
わせにして半田付けしてもよい。 In the above embodiment, a double-sided board and a single-sided board are used, but as described above, two double-sided boards may be used, and the ground plates may be soldered back to back between the two boards.
考案の効果 本考案の効果は、次のとおりである。Effect of invention The effects of the present invention are as follows.
(イ) 従来の高価な３層基板を用いることなく、製
造日数が短い２枚の基板を用いて両基板間にア
ース板を挿入することができるので、製造に要
する時間が短縮され、コストが低下する。(b) Instead of using the conventional expensive three-layer board, it is possible to insert a ground plate between the two boards using two boards that take less time to manufacture, which shortens the time required for manufacturing and reduces costs. descend.
(ロ) スルーホール・ピンを用いて半田付けするだ
けであるから、製造が簡単である。(b) Manufacture is simple because it only requires soldering using through-hole pins.
(ハ) 両基板間のクロストークは有効に防止され
る。(c) Crosstalk between both boards is effectively prevented.
第１図は従来例を示す一部断面図、第２及び第
３図は本考案の好適な実施例を示す一部断面図で
ある。
１……一方の基板、１1……１のアース・パタ
ーン、１2……小径の貫通孔、２……他方の基板、
２1……２のアース・パターン、２2……大径の貫
通孔、５……導電層、７……スルーホール・ピ
ン、８，９……半田。
FIG. 1 is a partial sectional view showing a conventional example, and FIGS. 2 and 3 are partial sectional views showing a preferred embodiment of the present invention. 1... One board, 1 1 ... 1 ground pattern, 1 2 ... Small diameter through hole, 2... Other board,
2 1 ... 2 earth pattern, 2 2 ... large diameter through hole, 5 ... conductive layer, 7 ... through-hole pin, 8, 9 ... solder.
Claims (1)
面に夫々アース・パターンを設け、少くとも一方
の基板の内側の面に導電層を設け、更に上記両基
板に夫々互いに径の異なる貫通孔を設け、これら
の貫通孔のうち小径のものとほぼ同径のスルーホ
ール・ピンを上記両貫通孔に挿通して、このスル
ーホール・ピンを上記両基板の上記アース・パタ
ーン及び上記導電層に半田付けして成るプリント
基板。 Two substrates facing each other are provided, a ground pattern is provided on the outer surface of each of the two substrates, a conductive layer is provided on the inner surface of at least one of the substrates, and a through hole having a different diameter is provided on each of the two substrates. Holes are provided, and through-hole pins having approximately the same diameter as the smaller one of these through-holes are inserted into both of the through-holes, and the through-hole pins are connected to the ground pattern and the conductive layer of both of the substrates. A printed circuit board made by soldering to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9036483U JPS59195771U (en) | 1983-06-13 | 1983-06-13 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9036483U JPS59195771U (en) | 1983-06-13 | 1983-06-13 | Printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59195771U JPS59195771U (en) | 1984-12-26 |
| JPH0143877Y2 true JPH0143877Y2 (en) | 1989-12-19 |
Family
ID=30220283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9036483U Granted JPS59195771U (en) | 1983-06-13 | 1983-06-13 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59195771U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5116254A (en) * | 1974-07-31 | 1976-02-09 | Toyota Motor Co Ltd | KORYUSHIKIDENKYOSETSUKINO YOSETSUDENRYUISOSEIGYOKAIRO |
| JPS5543279A (en) * | 1978-09-22 | 1980-03-27 | Nippon Soken Inc | Electronically controlled fuel injection device |
-
1983
- 1983-06-13 JP JP9036483U patent/JPS59195771U/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5116254A (en) * | 1974-07-31 | 1976-02-09 | Toyota Motor Co Ltd | KORYUSHIKIDENKYOSETSUKINO YOSETSUDENRYUISOSEIGYOKAIRO |
| JPS5543279A (en) * | 1978-09-22 | 1980-03-27 | Nippon Soken Inc | Electronically controlled fuel injection device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59195771U (en) | 1984-12-26 |
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