JPS6464394A - Hybrid integrated circuit substrate - Google Patents
Hybrid integrated circuit substrateInfo
- Publication number
- JPS6464394A JPS6464394A JP62222212A JP22221287A JPS6464394A JP S6464394 A JPS6464394 A JP S6464394A JP 62222212 A JP62222212 A JP 62222212A JP 22221287 A JP22221287 A JP 22221287A JP S6464394 A JPS6464394 A JP S6464394A
- Authority
- JP
- Japan
- Prior art keywords
- film
- substance
- substrate
- dielectric constant
- faces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
PURPOSE:To make a small substrate and to make a transmission speed of a signal fast by a method wherein a substance of high dielectric constant is pierced through a ceramic substrate and is buried so that both end faces are on the same plane as faces of the ceramic substrate and one pair of capacitor electrodes in the form of a film are formed at end face parts of the substance of high dielectric constant. CONSTITUTION:An inner-layer pattern 5 in the form of a film is formed at a desired part between ceramic substrates 1; resistors 6 having a desired resistance value are formed in the form of the film. Through holes are made in the ceramic substrates 1; a substance 20 of high dielectric constant is filled in the through holes in such a way that both end faces are on the same plane as faces of the ceramic substrates 1; conductors are formed on both end faces in the form of the film; one pair of capacitor electrodes 7A, 7B are formed in the form of the film. The inner-layer pattern 5, the resistors 6 and the capacitor electrodes are connected through via holes 8; in addition, desired circuit patterns 12 and a pad are formed on the surface of the substrate; a chip component 10 is mounted on the pad by using a solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62222212A JPS6464394A (en) | 1987-09-04 | 1987-09-04 | Hybrid integrated circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62222212A JPS6464394A (en) | 1987-09-04 | 1987-09-04 | Hybrid integrated circuit substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6464394A true JPS6464394A (en) | 1989-03-10 |
Family
ID=16778889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62222212A Pending JPS6464394A (en) | 1987-09-04 | 1987-09-04 | Hybrid integrated circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6464394A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01298796A (en) * | 1988-05-26 | 1989-12-01 | Nippon Denso Co Ltd | Hybrid integrated circuit |
| JPH04299889A (en) * | 1990-12-17 | 1992-10-23 | Hughes Aircraft Co | Capacitor structure |
| EP1581035A3 (en) * | 2004-02-27 | 2007-08-15 | TDK Corporation | Multilayer ceramic substrate and its production method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58180093A (en) * | 1982-04-16 | 1983-10-21 | 株式会社日立製作所 | Method of producing multilayer circuit board |
-
1987
- 1987-09-04 JP JP62222212A patent/JPS6464394A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58180093A (en) * | 1982-04-16 | 1983-10-21 | 株式会社日立製作所 | Method of producing multilayer circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01298796A (en) * | 1988-05-26 | 1989-12-01 | Nippon Denso Co Ltd | Hybrid integrated circuit |
| JPH04299889A (en) * | 1990-12-17 | 1992-10-23 | Hughes Aircraft Co | Capacitor structure |
| EP1581035A3 (en) * | 2004-02-27 | 2007-08-15 | TDK Corporation | Multilayer ceramic substrate and its production method |
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