JPS5575257A - Substrate circuit device - Google Patents

Substrate circuit device

Info

Publication number
JPS5575257A
JPS5575257A JP14907478A JP14907478A JPS5575257A JP S5575257 A JPS5575257 A JP S5575257A JP 14907478 A JP14907478 A JP 14907478A JP 14907478 A JP14907478 A JP 14907478A JP S5575257 A JPS5575257 A JP S5575257A
Authority
JP
Japan
Prior art keywords
holes
substrate
electrodes
heat
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14907478A
Other languages
Japanese (ja)
Other versions
JPS5628381B2 (en
Inventor
Sadakimi Ooyama
Sadao Yaguchi
Mikito Baba
Morikazu Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsumi Electric Co Ltd
Original Assignee
Mitsumi Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsumi Electric Co Ltd filed Critical Mitsumi Electric Co Ltd
Priority to JP14907478A priority Critical patent/JPS5575257A/en
Priority to DE19792915240 priority patent/DE2915240A1/en
Publication of JPS5575257A publication Critical patent/JPS5575257A/en
Publication of JPS5628381B2 publication Critical patent/JPS5628381B2/ja
Priority to US06/433,729 priority patent/US4437140A/en
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To protect circuit parts against heat occurred upon dipping thereof in solder by providing conductive material and laminated pattern of insulating material on the back surface of a ceramic substrate and inserting the leads of the part into the surface of the substrate.
CONSTITUTION: Conductive patterns 41, 42 by paste of Mo or the like are alternatively laminated with ceramic insulating layers 51, 52 on a ceramic substrate 1 provided with through-holes therethrough, and electrode 6 is provided by silver paste at the holes 2c∼3d on the surface of the insulating layer 52 to be connected to predetermined conductive patterns 41, 42, respectively. Similarly, the electrodes 6 conductive with the wiring patterns 41, 42 through the through-holes 3a, 3b, respectively of the upper surface of the substrate are printed thereon. Then, a resistor 7 is printed between the electrodes 6, and glass or the like coating layer 8 is formed on the portion except the holes 2a, 2b. After the semiconductor package 9 is connected fixedly to the electrodes 6 on the substrate 1, coils 10 are inserted into the holes 2a, 2b, respectively, and a lead terminal 10a is soldered at 14 by solder dipping process. Accordingly to this configuration, it can protect the circuit parts weak against the heat against the heat adverse effect.
COPYRIGHT: (C)1980,JPO&Japio
JP14907478A 1978-06-28 1978-12-04 Substrate circuit device Granted JPS5575257A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP14907478A JPS5575257A (en) 1978-12-04 1978-12-04 Substrate circuit device
DE19792915240 DE2915240A1 (en) 1978-06-28 1979-04-14 PRINTED CIRCUIT
US06/433,729 US4437140A (en) 1978-06-28 1982-10-12 Printed circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14907478A JPS5575257A (en) 1978-12-04 1978-12-04 Substrate circuit device

Publications (2)

Publication Number Publication Date
JPS5575257A true JPS5575257A (en) 1980-06-06
JPS5628381B2 JPS5628381B2 (en) 1981-07-01

Family

ID=15467113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14907478A Granted JPS5575257A (en) 1978-06-28 1978-12-04 Substrate circuit device

Country Status (1)

Country Link
JP (1) JPS5575257A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5941476U (en) * 1982-09-09 1984-03-16 株式会社ニッコウ電子 video game equipment
JPS5941477U (en) * 1982-09-10 1984-03-16 林　泰三 video game device
JPS6097188U (en) * 1983-12-07 1985-07-02 株式会社日本商事 Game machine with money changer
JPH0537350Y2 (en) * 1985-07-12 1993-09-21
JPS6218780U (en) * 1985-07-12 1987-02-04

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5262871U (en) * 1975-11-05 1977-05-10

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5262871U (en) * 1975-11-05 1977-05-10

Also Published As

Publication number Publication date
JPS5628381B2 (en) 1981-07-01

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