JPS5575258A - Substrate circuit device - Google Patents

Substrate circuit device

Info

Publication number
JPS5575258A
JPS5575258A JP14907578A JP14907578A JPS5575258A JP S5575258 A JPS5575258 A JP S5575258A JP 14907578 A JP14907578 A JP 14907578A JP 14907578 A JP14907578 A JP 14907578A JP S5575258 A JPS5575258 A JP S5575258A
Authority
JP
Japan
Prior art keywords
electrodes
circuit parts
ceramic
board
electroconductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14907578A
Other languages
Japanese (ja)
Inventor
Sadakimi Ooyama
Sadao Yaguchi
Mikito Baba
Morikazu Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsumi Electric Co Ltd
Original Assignee
Mitsumi Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsumi Electric Co Ltd filed Critical Mitsumi Electric Co Ltd
Priority to JP14907578A priority Critical patent/JPS5575258A/en
Priority to DE19792915240 priority patent/DE2915240A1/en
Publication of JPS5575258A publication Critical patent/JPS5575258A/en
Priority to US06/433,729 priority patent/US4437140A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To protect circuit parts from heat when soldering is effected by immersion, by providing a laminated pattern of an electroconductive and an insulating materials on the reverse side of a ceramic substrate and laying the leads of the circuit parts through the substrate from the side of the laminated pattern.
CONSTITUTION: Electroconductive patterns 41, 42 made from a paste of molybdenum or the like and insulating ceramic layers 51, 52 are alternately provided on a ceramic board 1 which has through holes 2, 3. Electrodes 6 are made from a silver paste in surface holes 5a 5d of the insulating layer 52 and connected to the prescribed electroconductive patterns 41, 42. A resistor 7 and a semiconductor package 9 are electronconductively bonded to the electrodes 6. The lead terminals 10a of a coil 10 are inserted through the ceramic board from the side of the insulating layer 52 and soldered at 14 to the electrodes 6 on the board 1 by immersion. The circuit parts are thus protected from heat.
COPYRIGHT: (C)1980,JPO&Japio
JP14907578A 1978-06-28 1978-12-04 Substrate circuit device Pending JPS5575258A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP14907578A JPS5575258A (en) 1978-12-04 1978-12-04 Substrate circuit device
DE19792915240 DE2915240A1 (en) 1978-06-28 1979-04-14 PRINTED CIRCUIT
US06/433,729 US4437140A (en) 1978-06-28 1982-10-12 Printed circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14907578A JPS5575258A (en) 1978-12-04 1978-12-04 Substrate circuit device

Publications (1)

Publication Number Publication Date
JPS5575258A true JPS5575258A (en) 1980-06-06

Family

ID=15467136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14907578A Pending JPS5575258A (en) 1978-06-28 1978-12-04 Substrate circuit device

Country Status (1)

Country Link
JP (1) JPS5575258A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5044468A (en) * 1973-08-24 1975-04-21

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5044468A (en) * 1973-08-24 1975-04-21

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