JPS5044468A - - Google Patents
Info
- Publication number
- JPS5044468A JPS5044468A JP9505173A JP9505173A JPS5044468A JP S5044468 A JPS5044468 A JP S5044468A JP 9505173 A JP9505173 A JP 9505173A JP 9505173 A JP9505173 A JP 9505173A JP S5044468 A JPS5044468 A JP S5044468A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9505173A JPS5648999B2 (en) | 1973-08-24 | 1973-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9505173A JPS5648999B2 (en) | 1973-08-24 | 1973-08-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5044468A true JPS5044468A (en) | 1975-04-21 |
| JPS5648999B2 JPS5648999B2 (en) | 1981-11-19 |
Family
ID=14127244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9505173A Expired JPS5648999B2 (en) | 1973-08-24 | 1973-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5648999B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5575258A (en) * | 1978-12-04 | 1980-06-06 | Mitsumi Electric Co Ltd | Substrate circuit device |
| JPS62136097A (en) * | 1985-12-10 | 1987-06-19 | 松下電器産業株式会社 | Method of attaching parts to printed wiring board |
| JPH0284793A (en) * | 1988-07-28 | 1990-03-26 | Japan Electron Control Syst Co Ltd | Improving method for solder rise from through-hole |
| JPH0334496A (en) * | 1989-06-30 | 1991-02-14 | Toshiba Corp | Method of soldering insertion type lead terminal |
| JPH0645743A (en) * | 1992-07-24 | 1994-02-18 | Matsushita Electric Ind Co Ltd | Circuit board and soldering thereof |
| JP2005224788A (en) * | 2004-01-13 | 2005-08-25 | Asahi Tec Corp | Sand sedimentation pond facility, removal method for sand using the same, and sand sedimentation pond |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0382295U (en) * | 1989-12-13 | 1991-08-22 |
-
1973
- 1973-08-24 JP JP9505173A patent/JPS5648999B2/ja not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5575258A (en) * | 1978-12-04 | 1980-06-06 | Mitsumi Electric Co Ltd | Substrate circuit device |
| JPS62136097A (en) * | 1985-12-10 | 1987-06-19 | 松下電器産業株式会社 | Method of attaching parts to printed wiring board |
| JPH0284793A (en) * | 1988-07-28 | 1990-03-26 | Japan Electron Control Syst Co Ltd | Improving method for solder rise from through-hole |
| JPH0334496A (en) * | 1989-06-30 | 1991-02-14 | Toshiba Corp | Method of soldering insertion type lead terminal |
| JPH0645743A (en) * | 1992-07-24 | 1994-02-18 | Matsushita Electric Ind Co Ltd | Circuit board and soldering thereof |
| JP2005224788A (en) * | 2004-01-13 | 2005-08-25 | Asahi Tec Corp | Sand sedimentation pond facility, removal method for sand using the same, and sand sedimentation pond |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5648999B2 (en) | 1981-11-19 |