JPS57157552A - Thin film circuit device - Google Patents

Thin film circuit device

Info

Publication number
JPS57157552A
JPS57157552A JP56042959A JP4295981A JPS57157552A JP S57157552 A JPS57157552 A JP S57157552A JP 56042959 A JP56042959 A JP 56042959A JP 4295981 A JP4295981 A JP 4295981A JP S57157552 A JPS57157552 A JP S57157552A
Authority
JP
Japan
Prior art keywords
thin film
substrate
solder
covered
external terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56042959A
Other languages
Japanese (ja)
Inventor
Masaaki Fuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56042959A priority Critical patent/JPS57157552A/en
Publication of JPS57157552A publication Critical patent/JPS57157552A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To provide an inexpensive thin film circuit device and to enhance the yield of the device by forming the device which includes a thin film capacitance element on an insulating substrate, covering the surface of the substrate including the element without an external terminal mounting portion with insulating resin and soldering by a solder dipping method the terminal to the exposed portion. CONSTITUTION:A thin film capacitance element 2, a thin film resistance element 3 and a passive element made of thin film conductors 4 are formed on an insulating substrate made of ceramic, and the resistance of the element 3 is adjusted by a laser trimming method. Then, the surface of a substrate 1 except an external terminal mounting electrode and a semiconductor IC chip mounting electrode is covered by a screen printing method with insulating resin 8, a semiconductor IC chip 5 is mounted on the portion not covered with the resin 8, and is covered with insulating resin 6. Subsequently, a plurality of solder plated external terminal 7' is mounted on the substrate 1, and is secured by a solder dipping method with solder 9. In this manner, thermal influence to the thin film circuit can be reduced.
JP56042959A 1981-03-24 1981-03-24 Thin film circuit device Pending JPS57157552A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56042959A JPS57157552A (en) 1981-03-24 1981-03-24 Thin film circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56042959A JPS57157552A (en) 1981-03-24 1981-03-24 Thin film circuit device

Publications (1)

Publication Number Publication Date
JPS57157552A true JPS57157552A (en) 1982-09-29

Family

ID=12650560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56042959A Pending JPS57157552A (en) 1981-03-24 1981-03-24 Thin film circuit device

Country Status (1)

Country Link
JP (1) JPS57157552A (en)

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