JPS56105668A - Thick film hybrid ic - Google Patents

Thick film hybrid ic

Info

Publication number
JPS56105668A
JPS56105668A JP783080A JP783080A JPS56105668A JP S56105668 A JPS56105668 A JP S56105668A JP 783080 A JP783080 A JP 783080A JP 783080 A JP783080 A JP 783080A JP S56105668 A JPS56105668 A JP S56105668A
Authority
JP
Japan
Prior art keywords
thick film
heat
radiating plate
solder
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP783080A
Other languages
Japanese (ja)
Inventor
Hitomi Nagayama
Hiromi Tozaki
Norikazu Nakamura
Nobuyuki Sugishita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP783080A priority Critical patent/JPS56105668A/en
Publication of JPS56105668A publication Critical patent/JPS56105668A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To obtain the thick film hybrid integrated circuit in high radiativity by a method wherein heat from a power transistor made a heat generating source is transmitted to a radiating plate through a terminal pin, a thick film conductor and solder, and the heat of a molden resin also is transmitted to the heat-radiating plate. CONSTITUTION:A thick film conducter paste in Ag/Pd system is printed on an alumina substrate 6 to simultaneously form a wiring conductor 7, external connecting terminal 8, land means 9 for connecting the parts mounted and land means 11 for the connection of a metallic heat radiating plate 10. Then, a thick film resistor, a thick film capacitor not shown in the drawings are mounted on those above means and the circuit is covered with a galss coat 13 with the connecting terminal being exposed. Thereafter, the solder paste is print-coated on the land means 9, 11, provided with the electrodes of a base, collector and emitter respectively and the power transistor 5 molded with resin or the like and the heat radiating plate 10 are mounted on the connecting means each to be connection-mounted with the solder 12.
JP783080A 1980-01-28 1980-01-28 Thick film hybrid ic Pending JPS56105668A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP783080A JPS56105668A (en) 1980-01-28 1980-01-28 Thick film hybrid ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP783080A JPS56105668A (en) 1980-01-28 1980-01-28 Thick film hybrid ic

Publications (1)

Publication Number Publication Date
JPS56105668A true JPS56105668A (en) 1981-08-22

Family

ID=11676506

Family Applications (1)

Application Number Title Priority Date Filing Date
JP783080A Pending JPS56105668A (en) 1980-01-28 1980-01-28 Thick film hybrid ic

Country Status (1)

Country Link
JP (1) JPS56105668A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0384301A2 (en) * 1989-02-17 1990-08-29 Nokia Mobile Phones Ltd. Cooling arrangement for a transistor
EP0449435A2 (en) * 1990-03-29 1991-10-02 Nokia Mobile Phones Ltd. Construction for cooling of a RF power transistor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0384301A2 (en) * 1989-02-17 1990-08-29 Nokia Mobile Phones Ltd. Cooling arrangement for a transistor
US5214309A (en) * 1989-02-17 1993-05-25 Nokia Mobile Phones Ltd. Thermally conductive bar cooling arrangement for a transistor
EP0449435A2 (en) * 1990-03-29 1991-10-02 Nokia Mobile Phones Ltd. Construction for cooling of a RF power transistor

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