JPS5567154A - Method of installing lead-less ic package - Google Patents
Method of installing lead-less ic packageInfo
- Publication number
- JPS5567154A JPS5567154A JP14131378A JP14131378A JPS5567154A JP S5567154 A JPS5567154 A JP S5567154A JP 14131378 A JP14131378 A JP 14131378A JP 14131378 A JP14131378 A JP 14131378A JP S5567154 A JPS5567154 A JP S5567154A
- Authority
- JP
- Japan
- Prior art keywords
- package
- hole
- substrate
- resin
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To improve wetproof properties, by applying adhesives around a through hole mounted to a printing substrate, by inserting an IC chip sealed with resin into the through hole, by placing a lead-less package substrate, by glueing the substrate, by soldering the substrate and conductors by means of an immersion method and by sealing the through hole with resin.
CONSTITUTION: A through hole 8 is bored to a printing wiring substrate manufactured by forming wiring circuit conductors 7a, 7b on a surface of an insulating substrate 6, and the circumference is coated with adhesives 9. The hole 8 is started to the centers of the wiring circuits 7a, 7b built up so as to connect external connecting terminal portions 2a', 2b' formed to the flanks of a lead-less IC package 5, and its diameter is made larger than a diameter of a resin sealing layer of the package 5. The resin sealing layer 4 of the package 5 is downward placed, the terminals 2a', 2b' of the package are positioned to the wiring circuit conductors 7a, 7b and the adhesives 9 are heated and hardened. The whole is soaked in melted solder, the solder 10a, 10b is attached, and wetproof resin 11 is filled in the hole 8, thus obtaining a device with high reliability.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14131378A JPS5567154A (en) | 1978-11-15 | 1978-11-15 | Method of installing lead-less ic package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14131378A JPS5567154A (en) | 1978-11-15 | 1978-11-15 | Method of installing lead-less ic package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5567154A true JPS5567154A (en) | 1980-05-21 |
| JPS6153852B2 JPS6153852B2 (en) | 1986-11-19 |
Family
ID=15288986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14131378A Granted JPS5567154A (en) | 1978-11-15 | 1978-11-15 | Method of installing lead-less ic package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5567154A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6027433U (en) * | 1983-07-29 | 1985-02-25 | 松下電工株式会社 | Electronic component mounting structure |
| JPS6078141U (en) * | 1983-10-31 | 1985-05-31 | 松下電工株式会社 | Electronic component mounting structure |
| KR100226782B1 (en) * | 1996-12-06 | 1999-10-15 | 김영환 | Structure of semiconductor package |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0530286Y2 (en) * | 1987-10-30 | 1993-08-03 | ||
| JPH0282876U (en) * | 1988-12-15 | 1990-06-27 |
-
1978
- 1978-11-15 JP JP14131378A patent/JPS5567154A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6027433U (en) * | 1983-07-29 | 1985-02-25 | 松下電工株式会社 | Electronic component mounting structure |
| JPS6078141U (en) * | 1983-10-31 | 1985-05-31 | 松下電工株式会社 | Electronic component mounting structure |
| KR100226782B1 (en) * | 1996-12-06 | 1999-10-15 | 김영환 | Structure of semiconductor package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6153852B2 (en) | 1986-11-19 |
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