JPS6442140A - Connection of integrated circuit - Google Patents

Connection of integrated circuit

Info

Publication number
JPS6442140A
JPS6442140A JP19866087A JP19866087A JPS6442140A JP S6442140 A JPS6442140 A JP S6442140A JP 19866087 A JP19866087 A JP 19866087A JP 19866087 A JP19866087 A JP 19866087A JP S6442140 A JPS6442140 A JP S6442140A
Authority
JP
Japan
Prior art keywords
heat
resin film
connection
resisting resin
lead wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19866087A
Other languages
Japanese (ja)
Inventor
Yoshiyuki Ikezoe
Junichi Imaizumi
Hiroshi Nomura
Eikichi Sato
Koichi Nagao
Koichi Kawamata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP19866087A priority Critical patent/JPS6442140A/en
Publication of JPS6442140A publication Critical patent/JPS6442140A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To obtain a low-cost and high-reliability connection material by a method wherein a heat-resisting resin film whose coefficient of thermal expansion is identical to that of a metal is used as a long and flexible substrate and this film is bonded directly to a sheet of metal foil such as copper coil without using an adhesive. CONSTITUTION:A flexible substrate to which a heat-resisting resin film 7 whose coefficient of thermal expansion is identical to that of a sheet of metal foil 6 has been bonded directly without making a hole in advance and without using an adhesive is used as a base material; a circuit in processed by using an ordinary technique for a printed-circuit board; a number of lead wires 6' are formed. During this process, the heat-resisting resin film 7 on the rear is left is a back-reinforcing material of the lead wires without making a hole even after the circuit has been formed. The surface of the lead wires is plated 8 by using tin, solder or the like; the plated part is aligned with a connection bump 9 of an IC chip 10; the connection bump 9 is electrically connected from the side of the heat-resisting resin film 7. By this setup, a process to make a hole and a back-masking process are not required; a lowcost connection is realized.
JP19866087A 1987-08-07 1987-08-07 Connection of integrated circuit Pending JPS6442140A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19866087A JPS6442140A (en) 1987-08-07 1987-08-07 Connection of integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19866087A JPS6442140A (en) 1987-08-07 1987-08-07 Connection of integrated circuit

Publications (1)

Publication Number Publication Date
JPS6442140A true JPS6442140A (en) 1989-02-14

Family

ID=16394924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19866087A Pending JPS6442140A (en) 1987-08-07 1987-08-07 Connection of integrated circuit

Country Status (1)

Country Link
JP (1) JPS6442140A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008029917A (en) * 2006-07-26 2008-02-14 Fuji Xerox Co Ltd Functional material-coating device and functional material-coating method
JP2008182222A (en) * 2006-12-28 2008-08-07 Mitsui Mining & Smelting Co Ltd Flexible printed circuit board and semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008029917A (en) * 2006-07-26 2008-02-14 Fuji Xerox Co Ltd Functional material-coating device and functional material-coating method
JP2008182222A (en) * 2006-12-28 2008-08-07 Mitsui Mining & Smelting Co Ltd Flexible printed circuit board and semiconductor device

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