JPS6430240A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6430240A
JPS6430240A JP62186941A JP18694187A JPS6430240A JP S6430240 A JPS6430240 A JP S6430240A JP 62186941 A JP62186941 A JP 62186941A JP 18694187 A JP18694187 A JP 18694187A JP S6430240 A JPS6430240 A JP S6430240A
Authority
JP
Japan
Prior art keywords
semiconductor element
solder
tape carrier
coated
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62186941A
Other languages
Japanese (ja)
Other versions
JP2537630B2 (en
Inventor
Sadasumi Uchiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP62186941A priority Critical patent/JP2537630B2/en
Publication of JPS6430240A publication Critical patent/JPS6430240A/en
Application granted granted Critical
Publication of JP2537630B2 publication Critical patent/JP2537630B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To keep a semiconductor element free of thermal stress and to facilitate the installation of a high-density outer lead to a circuit substrate by a method wherein solder is applied only after the installation on a tape carrier of a semiconductor element in a semiconductor device which includes a tape carrier, with its outer lead coated with solder, mounted with the semiconductor element. CONSTITUTION:A semiconductor element 3 is bonded to an inner lead 2 of a tape carrier 1. Next, the top surface and side walls of the semiconductor element 3 including the inner lead 2 are sealed up with a resin 4 which may be epoxy or silicone resin and the rear surface of the semiconductor element 3 is coated with a resin 5. A soldering process follows wherein an outer lead 6 of the tape carrier 1 is coated with a solder 7. This design keeps short- circuiting from taking place between fine-pitch out leads and lead strength from decreasing due to erosion by solder. With the entire process being accomplished without application of heat to the product, the result is a high-reliability semiconductor device with its semiconductor elements free of heat-caused damage.
JP62186941A 1987-07-27 1987-07-27 Method for manufacturing semiconductor device Expired - Lifetime JP2537630B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62186941A JP2537630B2 (en) 1987-07-27 1987-07-27 Method for manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62186941A JP2537630B2 (en) 1987-07-27 1987-07-27 Method for manufacturing semiconductor device

Publications (2)

Publication Number Publication Date
JPS6430240A true JPS6430240A (en) 1989-02-01
JP2537630B2 JP2537630B2 (en) 1996-09-25

Family

ID=16197401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62186941A Expired - Lifetime JP2537630B2 (en) 1987-07-27 1987-07-27 Method for manufacturing semiconductor device

Country Status (1)

Country Link
JP (1) JP2537630B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03125440A (en) * 1989-10-09 1991-05-28 Rohm Co Ltd Electronic parts

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS572536A (en) * 1980-06-06 1982-01-07 Seiko Epson Corp Semiconductor device
JPS5730353A (en) * 1980-07-30 1982-02-18 Nec Corp Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS572536A (en) * 1980-06-06 1982-01-07 Seiko Epson Corp Semiconductor device
JPS5730353A (en) * 1980-07-30 1982-02-18 Nec Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03125440A (en) * 1989-10-09 1991-05-28 Rohm Co Ltd Electronic parts

Also Published As

Publication number Publication date
JP2537630B2 (en) 1996-09-25

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