JPS54102971A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54102971A
JPS54102971A JP893878A JP893878A JPS54102971A JP S54102971 A JPS54102971 A JP S54102971A JP 893878 A JP893878 A JP 893878A JP 893878 A JP893878 A JP 893878A JP S54102971 A JPS54102971 A JP S54102971A
Authority
JP
Japan
Prior art keywords
opening
plastic deformation
metal
deformation modulus
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP893878A
Other languages
Japanese (ja)
Inventor
Bunji Takeuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP893878A priority Critical patent/JPS54102971A/en
Publication of JPS54102971A publication Critical patent/JPS54102971A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

PURPOSE: To prevent effectively the malformation of the mount part by drilling the opening to the ceramic package which stores the semiconductor chip, dealing up the opening with the metal featuring a large plastic deformation modulus and then fixing the metal onto another metal featuring a small plastic deformation modulus.
CONSTITUTION: For the semiconductor device which stores semiconductor chip 18 such as LSI or the like, ambient unit 31 is formed into a body with 1st and 2nd ceramic plates 12 and 15 laminated. Then opening 32 and 35 are provided to plate 12 and 15 respectively. Opening 32 is then sealed up with 1st metal component 10 featuring a large plastic deformation modulus and 2nd metal component 11 of a small plastic deformation modulus is adhered on component 10 via the silver soldering. Then chip 18 is mounted on component 11. Then the conductor pattern formed on chip 18 is connected to the conductor pattern on plate 12 via bonding wire 19 to be then led out to lead 14.
COPYRIGHT: (C)1979,JPO&Japio
JP893878A 1978-01-31 1978-01-31 Semiconductor device Pending JPS54102971A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP893878A JPS54102971A (en) 1978-01-31 1978-01-31 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP893878A JPS54102971A (en) 1978-01-31 1978-01-31 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS54102971A true JPS54102971A (en) 1979-08-13

Family

ID=11706600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP893878A Pending JPS54102971A (en) 1978-01-31 1978-01-31 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54102971A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524440A (en) * 1978-08-08 1980-02-21 Mitsubishi Electric Corp Ceramic package
JPS5976450A (en) * 1982-10-23 1984-05-01 Fujitsu Ltd Semiconductor device
JPS59218737A (en) * 1983-05-25 1984-12-10 Narumi China Corp Package for semiconductor device
JPS61270850A (en) * 1985-05-25 1986-12-01 Narumi China Corp Package for mounting semiconductor chip

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524440A (en) * 1978-08-08 1980-02-21 Mitsubishi Electric Corp Ceramic package
JPS5976450A (en) * 1982-10-23 1984-05-01 Fujitsu Ltd Semiconductor device
JPS59218737A (en) * 1983-05-25 1984-12-10 Narumi China Corp Package for semiconductor device
JPS61270850A (en) * 1985-05-25 1986-12-01 Narumi China Corp Package for mounting semiconductor chip

Similar Documents

Publication Publication Date Title
MY117421A (en) Integral design features for heatsink attach for electronic packages
JPS53149763A (en) Mounting method of semiconductor integrate circuit
MY134172A (en) Power chip scale package
EP0269336A3 (en) Semiconductor integrated circuit packages
TW365035B (en) Semiconductor device package having a board, manufacturing method thereof and stack package using the same
JPS56122156A (en) Lead frame for semiconductor device
JPS54102971A (en) Semiconductor device
JPS5389368A (en) Production of semiconductor integrated circuit
JPS6431443A (en) Semiconductor device
EP0264128A3 (en) Jumper chip for semiconductor devices
JPS6473753A (en) Semiconductor integrated circuit device
JPS5449066A (en) Semiconductor device
JPS53135579A (en) Liquid sealing semiconductor device
JPS6489546A (en) Semiconductor device
KR940005200A (en) Wiring surface treatment method on wiring board
JPS5571051A (en) Semiconductor device
JPS6489356A (en) Hybrid integrated circuit
JPS6484646A (en) Manufacture of semiconductor package
KR930007920Y1 (en) Double package structure having both side thin film
JPS6467947A (en) Ic package substrate
JPS556862A (en) Mounting structure of ic for electronic timepiece
JPS5290975A (en) Electronic wristwatch
JPS5480679A (en) Manufacture for semiconductor device
JPS5447571A (en) Electronic parts
JPS5571050A (en) Semiconductor device