JPS54102971A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS54102971A JPS54102971A JP893878A JP893878A JPS54102971A JP S54102971 A JPS54102971 A JP S54102971A JP 893878 A JP893878 A JP 893878A JP 893878 A JP893878 A JP 893878A JP S54102971 A JPS54102971 A JP S54102971A
- Authority
- JP
- Japan
- Prior art keywords
- opening
- plastic deformation
- metal
- deformation modulus
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 229910052751 metal Inorganic materials 0.000 abstract 5
- 239000002184 metal Substances 0.000 abstract 5
- 239000000919 ceramic Substances 0.000 abstract 2
- 239000004020 conductor Substances 0.000 abstract 2
- 238000005553 drilling Methods 0.000 abstract 1
- 230000036244 malformation Effects 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound data:image/svg+xml;base64,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 data:image/svg+xml;base64,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 [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
PURPOSE: To prevent effectively the malformation of the mount part by drilling the opening to the ceramic package which stores the semiconductor chip, dealing up the opening with the metal featuring a large plastic deformation modulus and then fixing the metal onto another metal featuring a small plastic deformation modulus.
CONSTITUTION: For the semiconductor device which stores semiconductor chip 18 such as LSI or the like, ambient unit 31 is formed into a body with 1st and 2nd ceramic plates 12 and 15 laminated. Then opening 32 and 35 are provided to plate 12 and 15 respectively. Opening 32 is then sealed up with 1st metal component 10 featuring a large plastic deformation modulus and 2nd metal component 11 of a small plastic deformation modulus is adhered on component 10 via the silver soldering. Then chip 18 is mounted on component 11. Then the conductor pattern formed on chip 18 is connected to the conductor pattern on plate 12 via bonding wire 19 to be then led out to lead 14.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP893878A JPS54102971A (en) | 1978-01-31 | 1978-01-31 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP893878A JPS54102971A (en) | 1978-01-31 | 1978-01-31 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54102971A true JPS54102971A (en) | 1979-08-13 |
Family
ID=11706600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP893878A Pending JPS54102971A (en) | 1978-01-31 | 1978-01-31 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54102971A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5524440A (en) * | 1978-08-08 | 1980-02-21 | Mitsubishi Electric Corp | Ceramic package |
| JPS5976450A (en) * | 1982-10-23 | 1984-05-01 | Fujitsu Ltd | Semiconductor device |
| JPS59218737A (en) * | 1983-05-25 | 1984-12-10 | Narumi China Corp | Package for semiconductor device |
| JPS61270850A (en) * | 1985-05-25 | 1986-12-01 | Narumi China Corp | Package for mounting semiconductor chip |
-
1978
- 1978-01-31 JP JP893878A patent/JPS54102971A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5524440A (en) * | 1978-08-08 | 1980-02-21 | Mitsubishi Electric Corp | Ceramic package |
| JPS5976450A (en) * | 1982-10-23 | 1984-05-01 | Fujitsu Ltd | Semiconductor device |
| JPS59218737A (en) * | 1983-05-25 | 1984-12-10 | Narumi China Corp | Package for semiconductor device |
| JPS61270850A (en) * | 1985-05-25 | 1986-12-01 | Narumi China Corp | Package for mounting semiconductor chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS63249345A (en) | Flexible mounting substrate | |
| JPS6312157A (en) | Heat resisting plastic semiconductor device | |
| JPH02187054A (en) | Construction of hybrid integrated circuit | |
| JPH04164361A (en) | Resin-sealed semiconductor device | |
| JPH03116948A (en) | Aluminum nitride package for superhigh frequency ic | |
| JPS54102971A (en) | Semiconductor device | |
| JPS5389368A (en) | Production of semiconductor integrated circuit | |
| JPH0451582A (en) | Hybrid integrated circuit device | |
| JPH01220837A (en) | Semiconductor integrated circuit device | |
| JPH02271561A (en) | Resin-sealed semiconductor device | |
| JPH0232547A (en) | Semiconductor packaging device | |
| JPH04155856A (en) | Hybrid integrated circuit device and manufacture thereof | |
| JPH0430563A (en) | Semiconductor integrated circuit device | |
| JPH03250657A (en) | Resin-sealed semiconductor device with both surfaces packaged | |
| JPH0237729A (en) | Manufacture of semiconductor device | |
| JPH03116949A (en) | Manufacture of ic package and ic package case | |
| JPH03198368A (en) | Semiconductor device | |
| JPH0387054A (en) | Semiconductor device | |
| JPH0250438A (en) | Semiconductor device | |
| JPS63283044A (en) | Semiconductor integrated circuit device | |
| JPH0273653A (en) | Package for semiconductor device | |
| JPS54131871A (en) | Packaging of ic case | |
| JPS63132460A (en) | Thin semiconductor module substrate | |
| JPS62283634A (en) | Semiconductor device | |
| JPS6484646A (en) | Manufacture of semiconductor package |