JPS56122156A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPS56122156A
JPS56122156A JP2633580A JP2633580A JPS56122156A JP S56122156 A JPS56122156 A JP S56122156A JP 2633580 A JP2633580 A JP 2633580A JP 2633580 A JP2633580 A JP 2633580A JP S56122156 A JPS56122156 A JP S56122156A
Authority
JP
Japan
Prior art keywords
stage
lead frame
internal leads
semiconductor device
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2633580A
Other languages
Japanese (ja)
Other versions
JPS6050343B2 (en
Inventor
Shinichi Wakabayashi
Sugio Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2633580A priority Critical patent/JPS6050343B2/en
Publication of JPS56122156A publication Critical patent/JPS56122156A/en
Publication of JPS6050343B2 publication Critical patent/JPS6050343B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To largely reduce the cost of a semiconductor device by covering the surface of a metallic substrate forming the stage and internal leads of a lead frame with copper or the like. CONSTITUTION:Iron-nickel alloy is used for the material of a lead frame having a stage 1 to which a semiconductor integrated circuit element is placed fixedly, internal leads 2 arranged on the periphery of the stage 1 and external leads 3 extended from the internal leads 2 respectively. The internal leads disposed slightly inside of a resin seal I and the external leads surrounded by a broken line frame on the surfaces are covered with metal (such as tin) readily soldable thereto. The stage and the internal leads II in the vicinity of the stage surrounded by a dotted broken line frame are covered with any of copper, copper alloy and aluminum. Thus, the cost of the semiconductor device can be largely reduced as compared with the conventional lead frame covered with noble metal, and preferable solderability thereof can be maintained.
JP2633580A 1980-03-03 1980-03-03 Lead frame for semiconductor device manufacturing Expired JPS6050343B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2633580A JPS6050343B2 (en) 1980-03-03 1980-03-03 Lead frame for semiconductor device manufacturing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2633580A JPS6050343B2 (en) 1980-03-03 1980-03-03 Lead frame for semiconductor device manufacturing

Publications (2)

Publication Number Publication Date
JPS56122156A true JPS56122156A (en) 1981-09-25
JPS6050343B2 JPS6050343B2 (en) 1985-11-08

Family

ID=12190557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2633580A Expired JPS6050343B2 (en) 1980-03-03 1980-03-03 Lead frame for semiconductor device manufacturing

Country Status (1)

Country Link
JP (1) JPS6050343B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57139952A (en) * 1981-02-25 1982-08-30 Toshiba Corp Resin sealing type semiconductor device
JPS58140645U (en) * 1982-03-16 1983-09-21 日立電線株式会社 IC lead frame
JPS59108335A (en) * 1982-12-14 1984-06-22 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS6030118A (en) * 1983-07-28 1985-02-15 日本ケミコン株式会社 Leadframe for electronic part
JPS63197364A (en) * 1987-02-12 1988-08-16 Goto Seisakusho:Kk Manufacture of semiconductor device
JPS63197363A (en) * 1987-02-12 1988-08-16 Goto Seisakusho:Kk Manufacture of semiconductor device
JPS6442845A (en) * 1987-08-10 1989-02-15 Rohm Co Ltd Electronic component and manufacture thereof

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS611919A (en) * 1984-06-13 1986-01-07 Matsushita Electric Ind Co Ltd Control device of combustion tool
JPS6293557U (en) * 1985-11-29 1987-06-15
JPH01100000A (en) * 1987-10-02 1989-04-18 Yazaki Corp Residual-quantity alarm system of kerosene
JPH0199999A (en) * 1987-10-02 1989-04-18 Yazaki Corp Kerosene tank with alarm
JPH01312325A (en) * 1988-06-10 1989-12-18 Sanyo Electric Co Ltd Control device for combustion device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57139952A (en) * 1981-02-25 1982-08-30 Toshiba Corp Resin sealing type semiconductor device
JPS58140645U (en) * 1982-03-16 1983-09-21 日立電線株式会社 IC lead frame
JPS59108335A (en) * 1982-12-14 1984-06-22 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS6030118A (en) * 1983-07-28 1985-02-15 日本ケミコン株式会社 Leadframe for electronic part
JPS6350850B2 (en) * 1983-07-28 1988-10-12 Nippon Chemicon
JPS63197364A (en) * 1987-02-12 1988-08-16 Goto Seisakusho:Kk Manufacture of semiconductor device
JPS63197363A (en) * 1987-02-12 1988-08-16 Goto Seisakusho:Kk Manufacture of semiconductor device
JPS6442845A (en) * 1987-08-10 1989-02-15 Rohm Co Ltd Electronic component and manufacture thereof

Also Published As

Publication number Publication date
JPS6050343B2 (en) 1985-11-08

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