JPS56124253A - Compound terminal for integrated circuit - Google Patents

Compound terminal for integrated circuit

Info

Publication number
JPS56124253A
JPS56124253A JP2660680A JP2660680A JPS56124253A JP S56124253 A JPS56124253 A JP S56124253A JP 2660680 A JP2660680 A JP 2660680A JP 2660680 A JP2660680 A JP 2660680A JP S56124253 A JPS56124253 A JP S56124253A
Authority
JP
Japan
Prior art keywords
terminal
alloy
pressure
brazing material
intermediate metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2660680A
Other languages
Japanese (ja)
Other versions
JPS6050344B2 (en
Inventor
Teruo Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daido Steel Co Ltd
Original Assignee
Daido Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daido Steel Co Ltd filed Critical Daido Steel Co Ltd
Priority to JP2660680A priority Critical patent/JPS6050344B2/en
Publication of JPS56124253A publication Critical patent/JPS56124253A/en
Publication of JPS6050344B2 publication Critical patent/JPS6050344B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To obtain a highly reliable terminal, by providing between a brazing material and a terminal material an intermediate metallic material having the same- level electric conductivity, thermal conductivity and rigidity as those of the brazing material. CONSTITUTION:A terminal piece B, which is composed of a terminal material 2 (such as Fe-42% Ni alloy) to which a brazing material (such as 72% Ag-28% Cu alloy) and an intermediate metallic material 5 (Cu or Cu alloy) are tightly attached, is made to contact a lead material 3 (such as Ni) which adhered to a ceramic type package 1, and it is heated and exposed to pressure P. In this mechanism, the pressure P does not have to big, the pressure can be adsorbed by the brazing material 2 and the intermediate metallic material 5, and occurrence of crack on the package 1 and bending of the terminal material 2 can be prevented, and therefore, it is possible to obtain a highly reliable terminal with a good heat-dissipating performance.
JP2660680A 1980-03-05 1980-03-05 Composite terminal for integrated circuits Expired JPS6050344B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2660680A JPS6050344B2 (en) 1980-03-05 1980-03-05 Composite terminal for integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2660680A JPS6050344B2 (en) 1980-03-05 1980-03-05 Composite terminal for integrated circuits

Publications (2)

Publication Number Publication Date
JPS56124253A true JPS56124253A (en) 1981-09-29
JPS6050344B2 JPS6050344B2 (en) 1985-11-08

Family

ID=12198156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2660680A Expired JPS6050344B2 (en) 1980-03-05 1980-03-05 Composite terminal for integrated circuits

Country Status (1)

Country Link
JP (1) JPS6050344B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236553A (en) * 1988-07-26 1990-02-06 Sumitomo Electric Ind Ltd Connection structure between components for semiconductor device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63148021A (en) * 1986-12-08 1988-06-20 Yamamoto Mfg Co Ltd Fuel supply device for grain drying machine
JPH0561652U (en) * 1991-12-28 1993-08-13 株式会社トヨトミ Refueling safety device for oil combustor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236553A (en) * 1988-07-26 1990-02-06 Sumitomo Electric Ind Ltd Connection structure between components for semiconductor device

Also Published As

Publication number Publication date
JPS6050344B2 (en) 1985-11-08

Similar Documents

Publication Publication Date Title
JPS57130441A (en) Integrated circuit device
JPS5471572A (en) Semiconductor device
JPS56124253A (en) Compound terminal for integrated circuit
JPS5568661A (en) Structure for mounting power transistor
JPS54124678A (en) Lead frame
JPS6318648A (en) Circuit board using aluminum nitride
IT1147903B (en) IMPROVEMENT IN SEMICONDUCTOR DEVICES WITH ENVELOPES OR ENCAPSULATIONS WITHOUT PLATING
US3027502A (en) Semiconductor device
GB1062006A (en) Semiconductor device with flexible lead
ES8501276A1 (en) Solder alloys for brazing contact materials.
JPS56122155A (en) Lead frame for semiconductor device
JPS5735363A (en) Semiconductor device
JPS56124249A (en) Semiconductor device
JPS57114242A (en) Semiconductor device
JPS55151341A (en) Semiconductor device
JPS56115550A (en) Manufacture of semiconductor device
JPS554904A (en) Semi-conductor device
GB895652A (en) Improvements in or relating to semiconductor valves
JPS57160138A (en) Lead frame for semiconductor device
JPS5778144A (en) Semiconductor device
JPS5720438A (en) Semiconductor device
JPS57121239A (en) Semiconductor device
JPS57109350A (en) Semiconductor device
JPS5323272A (en) Semiconductor device
JPS57132332A (en) Semiconductor device