JPS554904A - Semi-conductor device - Google Patents

Semi-conductor device

Info

Publication number
JPS554904A
JPS554904A JP7640778A JP7640778A JPS554904A JP S554904 A JPS554904 A JP S554904A JP 7640778 A JP7640778 A JP 7640778A JP 7640778 A JP7640778 A JP 7640778A JP S554904 A JPS554904 A JP S554904A
Authority
JP
Japan
Prior art keywords
cap
stem
tin
layer
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7640778A
Other languages
Japanese (ja)
Inventor
Koichi Yajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7640778A priority Critical patent/JPS554904A/en
Publication of JPS554904A publication Critical patent/JPS554904A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To prevent deterioration of performance characteristics by gold plating a stem whick has a metallized gold layer and a circuit pattern on a area where a cap of a ceramic base is to be sealed, and sealing by a solder containing more than 80% of tin with low temperature.
CONSTITUTION: A ceramic cap body 12a on a flat plate has a gold plated layer 12b where the body faces to a metallized gold layer 1e of a stem 1. The both layers 1e and 12b are combined by a silver-tin solder layer 13, thus hermetically sealing the cap to the stem. The layer 13 consists of 80 to 96.5% tin, and the remainder is silver. It covers a required area of the cap and is held between the cap and the stem for heating up to the melting point. This constitution provides inexpensive solder because it contains more than 80% of tin. Soldering temperature is also lower, thus preventing degradation of a semi-conductor and increasing its reliability.
COPYRIGHT: (C)1980,JPO&Japio
JP7640778A 1978-06-26 1978-06-26 Semi-conductor device Pending JPS554904A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7640778A JPS554904A (en) 1978-06-26 1978-06-26 Semi-conductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7640778A JPS554904A (en) 1978-06-26 1978-06-26 Semi-conductor device

Publications (1)

Publication Number Publication Date
JPS554904A true JPS554904A (en) 1980-01-14

Family

ID=13604390

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7640778A Pending JPS554904A (en) 1978-06-26 1978-06-26 Semi-conductor device

Country Status (1)

Country Link
JP (1) JPS554904A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03130842U (en) * 1990-04-18 1991-12-27
JPH03130843U (en) * 1990-04-18 1991-12-27
JPH03130841U (en) * 1990-04-18 1991-12-27
JPH03130844U (en) * 1990-04-18 1991-12-27

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03130842U (en) * 1990-04-18 1991-12-27
JPH03130843U (en) * 1990-04-18 1991-12-27
JPH03130841U (en) * 1990-04-18 1991-12-27
JPH03130844U (en) * 1990-04-18 1991-12-27

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