JPS5326573A - Semiconductor uni t - Google Patents

Semiconductor uni t

Info

Publication number
JPS5326573A
JPS5326573A JP10057976A JP10057976A JPS5326573A JP S5326573 A JPS5326573 A JP S5326573A JP 10057976 A JP10057976 A JP 10057976A JP 10057976 A JP10057976 A JP 10057976A JP S5326573 A JPS5326573 A JP S5326573A
Authority
JP
Japan
Prior art keywords
uni
semiconductor
ceramic substrate
diameter
responsibility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10057976A
Other languages
Japanese (ja)
Inventor
Yoichi Koyama
Keizo Otsuki
Toshiro Iba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10057976A priority Critical patent/JPS5326573A/en
Publication of JPS5326573A publication Critical patent/JPS5326573A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: When a dual inline type semiconductor unit is sealed hermetically on a laminated ceramic substrate, the diameter of a metallic plate for sealing is formed smaller than the outside diameter of a metallic ring and is welded electrically, so that a melting metal can be prevented from flowing out to the ceramic substrate and therefore responsibility can be improved.
COPYRIGHT: (C)1978,JPO&Japio
JP10057976A 1976-08-25 1976-08-25 Semiconductor uni t Pending JPS5326573A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10057976A JPS5326573A (en) 1976-08-25 1976-08-25 Semiconductor uni t

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10057976A JPS5326573A (en) 1976-08-25 1976-08-25 Semiconductor uni t

Publications (1)

Publication Number Publication Date
JPS5326573A true JPS5326573A (en) 1978-03-11

Family

ID=14277790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10057976A Pending JPS5326573A (en) 1976-08-25 1976-08-25 Semiconductor uni t

Country Status (1)

Country Link
JP (1) JPS5326573A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856357A (en) * 1981-09-30 1983-04-04 Fujitsu Ltd Package for semiconductor device
JPS594060A (en) * 1982-06-30 1984-01-10 Fujitsu Ltd Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856357A (en) * 1981-09-30 1983-04-04 Fujitsu Ltd Package for semiconductor device
JPH0252425B2 (en) * 1981-09-30 1990-11-13 Fujitsu Ltd
JPS594060A (en) * 1982-06-30 1984-01-10 Fujitsu Ltd Semiconductor device

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