JPS5466772A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5466772A
JPS5466772A JP13378777A JP13378777A JPS5466772A JP S5466772 A JPS5466772 A JP S5466772A JP 13378777 A JP13378777 A JP 13378777A JP 13378777 A JP13378777 A JP 13378777A JP S5466772 A JPS5466772 A JP S5466772A
Authority
JP
Japan
Prior art keywords
metal plate
closing body
projection part
circumference
constitution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13378777A
Other languages
Japanese (ja)
Other versions
JPS5850425B2 (en
Inventor
Mitsuo Odate
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13378777A priority Critical patent/JPS5850425B2/en
Priority to US05/957,330 priority patent/US4274106A/en
Priority to DE2848252A priority patent/DE2848252C2/en
Publication of JPS5466772A publication Critical patent/JPS5466772A/en
Publication of JPS5850425B2 publication Critical patent/JPS5850425B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To increase the capability for explosion, by providing the closing body consisting of the material not easily deformed with the path from semiconductor element to flexible metal plate.
CONSTITUTION: External circumference is welded on the edge 10 of the aluminum 8 for the flexible metal plate 13, and the projecting part of the main electrode is fitted to the inner circumference. The projection part 14 is provided with the size of about 2mm wide and about 1mm thick at the full circumferenc of the main electrode. The closing body 15 made of iron is placed between the projection part 14 and aluminum 8, closing the path from the element 1 to the metal plate 13. Slit 16 is formed at the inner cricumference of the projection part 14 and the closing body. With this constitution, the molten chip of material molten with high temperature arc caused at the element circumference with short circuit is not contacted with the metal directly, the plasma of sealing gas is not directly contacted either, thereby remarkably increasing the capability of destruction.
COPYRIGHT: (C)1979,JPO&Japio
JP13378777A 1977-11-07 1977-11-07 semiconductor equipment Expired JPS5850425B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP13378777A JPS5850425B2 (en) 1977-11-07 1977-11-07 semiconductor equipment
US05/957,330 US4274106A (en) 1977-11-07 1978-11-03 Explosion proof vibration resistant flat package semiconductor device
DE2848252A DE2848252C2 (en) 1977-11-07 1978-11-07 Semiconductor component and method for its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13378777A JPS5850425B2 (en) 1977-11-07 1977-11-07 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS5466772A true JPS5466772A (en) 1979-05-29
JPS5850425B2 JPS5850425B2 (en) 1983-11-10

Family

ID=15112986

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13378777A Expired JPS5850425B2 (en) 1977-11-07 1977-11-07 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5850425B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015056487A (en) * 2013-09-11 2015-03-23 株式会社東芝 Semiconductor device
JP2018046190A (en) * 2016-09-15 2018-03-22 株式会社東芝 Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015056487A (en) * 2013-09-11 2015-03-23 株式会社東芝 Semiconductor device
JP2018046190A (en) * 2016-09-15 2018-03-22 株式会社東芝 Semiconductor device

Also Published As

Publication number Publication date
JPS5850425B2 (en) 1983-11-10

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