JPS5466772A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5466772A JPS5466772A JP13378777A JP13378777A JPS5466772A JP S5466772 A JPS5466772 A JP S5466772A JP 13378777 A JP13378777 A JP 13378777A JP 13378777 A JP13378777 A JP 13378777A JP S5466772 A JPS5466772 A JP S5466772A
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- closing body
- projection part
- circumference
- constitution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To increase the capability for explosion, by providing the closing body consisting of the material not easily deformed with the path from semiconductor element to flexible metal plate.
CONSTITUTION: External circumference is welded on the edge 10 of the aluminum 8 for the flexible metal plate 13, and the projecting part of the main electrode is fitted to the inner circumference. The projection part 14 is provided with the size of about 2mm wide and about 1mm thick at the full circumferenc of the main electrode. The closing body 15 made of iron is placed between the projection part 14 and aluminum 8, closing the path from the element 1 to the metal plate 13. Slit 16 is formed at the inner cricumference of the projection part 14 and the closing body. With this constitution, the molten chip of material molten with high temperature arc caused at the element circumference with short circuit is not contacted with the metal directly, the plasma of sealing gas is not directly contacted either, thereby remarkably increasing the capability of destruction.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13378777A JPS5850425B2 (en) | 1977-11-07 | 1977-11-07 | semiconductor equipment |
US05/957,330 US4274106A (en) | 1977-11-07 | 1978-11-03 | Explosion proof vibration resistant flat package semiconductor device |
DE2848252A DE2848252C2 (en) | 1977-11-07 | 1978-11-07 | Semiconductor component and method for its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13378777A JPS5850425B2 (en) | 1977-11-07 | 1977-11-07 | semiconductor equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5466772A true JPS5466772A (en) | 1979-05-29 |
JPS5850425B2 JPS5850425B2 (en) | 1983-11-10 |
Family
ID=15112986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13378777A Expired JPS5850425B2 (en) | 1977-11-07 | 1977-11-07 | semiconductor equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5850425B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015056487A (en) * | 2013-09-11 | 2015-03-23 | 株式会社東芝 | Semiconductor device |
JP2018046190A (en) * | 2016-09-15 | 2018-03-22 | 株式会社東芝 | Semiconductor device |
-
1977
- 1977-11-07 JP JP13378777A patent/JPS5850425B2/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015056487A (en) * | 2013-09-11 | 2015-03-23 | 株式会社東芝 | Semiconductor device |
JP2018046190A (en) * | 2016-09-15 | 2018-03-22 | 株式会社東芝 | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS5850425B2 (en) | 1983-11-10 |
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